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  6. XAZU3EG-1SBVA484Q
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    Mfr.Part #
    XAZU3EG-1SBVA484Q
    Manufacturer
    AMD Xilinx
    Package / Case
    484-BFBGA, FCBGA
    Datasheet
    Download
    Description
    XAZU3EG-1SBVA484Q
    Stock
    26,945
    In Stock ：
    26,945

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Length :
    19mm
    Operating Temperature :
    -40°C~125°C TJ
    Core Processor :
    Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™
    Speed :
    500MHz, 1.2GHz
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Package / Case :
    484-BFBGA, FCBGA
    Factory Lead Time :
    6 Weeks
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Packaging :
    Tray
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    JESD-30 Code :
    S-PBGA-B484
    Height Seated (Max) :
    2.61mm
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Number of Terminations :
    484
    Number of I/O :
    128
    Architecture :
    MPU, FPGA
    RoHS Status :
    ROHS3 Compliant
    Terminal Pitch :
    0.8mm
    Terminal Position :
    BOTTOM
    Supply Voltage :
    0.85V
    RAM Size :
    1.8MB
    Terminal Form :
    Ball
    HTS Code :
    8542.31.00.01
    Width :
    19mm
    Peripherals :
    DMA, WDT
    Surface Mount :
    yes
    Datasheets
    XAZU3EG-1SBVA484Q
    Introducing System On Chip (SoC) AMD Xilinx XAZU3EG-1SBVA484Q from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~125°C TJ, Package / Case：484-BFBGA, FCBGA, Number of Terminations：484, XAZU3EG-1SBVA484Q pinout, XAZU3EG-1SBVA484Q datasheet PDF, XAZU3EG-1SBVA484Q amp .Beyond System On Chip (SoC) AMD Xilinx XAZU3EG-1SBVA484Q ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XAZU3EG-1SBVA484Q


    484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V

    This SoC is built on Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ core processor(s).


    A Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package.With 1.8MB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MPU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~125°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.128 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.There are 484 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

    Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ processor.


    1.8MB RAM.
    Built on MPU, FPGA.
    MICROPROCESSOR CIRCUIT


    There are a lot of Xilinx Inc.


    XAZU3EG-1SBVA484Q System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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