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  6. XAZU2EG-L1SFVC784I
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    Mfr.Part #
    XAZU2EG-L1SFVC784I
    Manufacturer
    AMD Xilinx
    Package / Case
    784-BFBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 784FCBGA
    Stock
    11,922
    In Stock ：
    11,922

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Peripherals :
    DMA, WDT
    HTS Code :
    8542.31.00.01
    Speed :
    500MHz, 1.2GHz
    Terminal Position :
    BOTTOM
    Architecture :
    MPU, FPGA
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Terminal Pitch :
    0.8mm
    Operating Temperature :
    -40°C~100°C TJ
    Height Seated (Max) :
    3.32mm
    Number of I/O :
    128
    Number of Terminations :
    784
    Supply Voltage :
    0.72V
    Terminal Form :
    Ball
    JESD-30 Code :
    S-PBGA-B784
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Surface Mount :
    yes
    Width :
    23mm
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Length :
    23mm
    Packaging :
    Tray
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Factory Lead Time :
    11 Weeks
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    Package / Case :
    784-BFBGA, FCBGA
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    RAM Size :
    1.2MB
    Moisture Sensitivity Level (MSL) :
    3 (168 Hours)
    Introducing System On Chip (SoC) AMD Xilinx XAZU2EG-L1SFVC784I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Number of Terminations：784, Package / Case：784-BFBGA, FCBGA, XAZU2EG-L1SFVC784I pinout, XAZU2EG-L1SFVC784I datasheet PDF, XAZU2EG-L1SFVC784I amp .Beyond System On Chip (SoC) AMD Xilinx XAZU2EG-L1SFVC784I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XAZU2EG-L1SFVC784I


    784 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.72V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 1.2MB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MPU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.128 I/Os in total are included in this SoC part.It is advised to utilize a 0.72V power supply.There are 784 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    1.2MB RAM.
    Built on MPU, FPGA.
    MICROPROCESSOR CIRCUIT


    There are a lot of Xilinx Inc.


    XAZU2EG-L1SFVC784I System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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