XA3S500E-4FTG256I
- Mfr.Part #
- XA3S500E-4FTG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FTBGA
- Stock
- 2,730
- In Stock :
- 2,730
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 17mm
- Number of Outputs :
- 149
- Number of I/O :
- 190
- Supply Voltage :
- 1.2V
- Published :
- 2006
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 1164
- Clock Frequency :
- 572MHz
- Package / Case :
- 256-LBGA
- JESD-609 Code :
- e1
- RAM Size :
- 45kB
- Terminal Form :
- Ball
- Operating Temperature :
- -40°C~100°C TJ
- Pbfree Code :
- yes
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 256
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Height Seated (Max) :
- 1.55mm
- Number of Pins :
- 256
- Number of Gates :
- 500000
- Series :
- Automotive, AEC-Q100, Spartan®-3E XA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Speed Grade :
- 4
- Mount :
- Surface Mount
- Power Supplies :
- 1.21.2/3.32.5V
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 368640
- ECCN Code :
- EAR99
- Number of Terminations :
- 256
- Base Part Number :
- XA3S500E
- Length :
- 17mm
- Number of Logic Elements/Cells :
- 10476
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Datasheets
- XA3S500E-4FTG256I

FPGAs AMD Xilinx XA3S500E-4FTG256I Overview
The FPGAs AMD Xilinx XA3S500E-4FTG256I is a high-performance, field-programmable gate array that is perfect for designers looking at leveraging the versatile and adaptive technology for complex digital circuits. Manufactured by the industry leader AMD Xilinx, this FPGA comes in a 256FTBGA (Fine Pitch Ball Grid Array) package, offering robustness for surface mounting on a variety of board sizes and complexities. With a substantial array of logical units and 190 I/O pins, this component is optimized for a seamless and efficient design flow, making it a go-to choice for a range of applications which demand high-speed operation and reliability. The device's capability to be programmed in-circuit allows for tremendous flexibility and longevity, as it can be updated with future-proofing in mind, addressing evolving technological needs.
XA3S500E-4FTG256I Features
- IC FPGA with 190 I/O pins
- 256FTBGA package for superior electrical connectivity
- Offered by the reputable AMD Xilinx, ensuring top-notch quality and support
- Adaptable to changes in design specifications and application requirements
- Ideal for complex digital integrations demanding high-speed and accuracy
XA3S500E-4FTG256I Applications
- Telecommunication Infrastructure: Utilized in creating flexible and upgradeable base station hardware, adapting to new communication protocols and standards.
- Industrial Control Systems: Acts as the brain within automation controllers, providing the processing power and I/O capabilities required for sophisticated industrial applications.
- Automotive Electronics: Instrumental in managing advanced driver-assistance systems (ADAS) by offering the necessary computational resources and reliability.
- Consumer Electronics: Empowers smart home devices and high-performance personal gadgets, facilitating advanced features and connectivity options.
- Medical Equipment: Assists in the diagnostics and treatment machines, where precision and programmability are paramount for patient safety and care.
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