XA3S1600E-4FGG484I

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Mfr.Part #
XA3S1600E-4FGG484I
Manufacturer
AMD Xilinx
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 376 I/O 484FBGA
Stock
4,058
In Stock :
4,058

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
484-BBGA
Max Operating Temperature :
100°C
Series :
Automotive, AEC-Q100, Spartan®-3E XA
Min Operating Temperature :
-40°C
Operating Temperature :
-40°C~100°C TJ
Supplier Device Package :
484-FBGA (23x23)
Base Part Number :
XA3S1600E
Number of Pins :
484
Number of Logic Blocks (LABs) :
3688
Published :
2007
Number of I/O :
376
Number of LABs/CLBs :
3688
Total RAM Bits :
663552
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Speed Grade :
4
RoHS Status :
ROHS3 Compliant
Packaging :
Tray
Number of Logic Elements/Cells :
33192
Factory Lead Time :
10 Weeks
Mount :
Surface Mount
Operating Supply Voltage :
1.2V
RAM Size :
81kB
Number of Gates :
1600000
Mounting Type :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA3S1600E-4FGG484I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BBGA, Operating Temperature:-40°C~100°C TJ, Base Part Number:XA3S1600E, Number of Pins:484, Mounting Type:Surface Mount, XA3S1600E-4FGG484I pinout, XA3S1600E-4FGG484I datasheet PDF, XA3S1600E-4FGG484I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA3S1600E-4FGG484I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA3S1600E-4FGG484I


FPGAs AMD Xilinx XA3S1600E-4FGG484I Overview

The AMD Xilinx XA3S1600E-4FGG484I represents a high-performance, highly flexible option within the field of field programmable gate arrays (FPGAs). Engineered to deliver superior speed and functionality, this FPGA is ideal for applications that require robust data processing and configurable logic solutions. The device, encased in a compact 484-ball fine-pitch BGA package, offers an expansive array of 376 I/Os, ensuring versatile connectivity and integration capabilities. Its resilient design is particularly suited for demanding environments, reflecting AMD Xilinx's commitment to reliability and high-tech innovation in FPGA technology.

XA3S1600E-4FGG484I Features

This particular model from AMD Xilinx incorporates numerous features that make it a potent solution for complex electronic designs. It includes a large number of logic cells, DSP slices for advanced signal processing, and high-speed serial transceivers, which are essential for high data rate applications. The FPGA also supports various memory interfaces, allowing designers to integrate it smoothly with existing systems and enhance overall performance.

XA3S1600E-4FGG484I Applications

  • Telecommunications: Utilized in network routers and switches to manage data flow efficiently and effectively, ensuring optimal network performance and reliability.
  • Automotive: Deployed in advanced driver-assistance systems (ADAS) to process real-time inputs from vehicle sensors, enhancing safety features such as collision avoidance systems.
  • Industrial: Applied in control systems for automation and robotics, providing the necessary flexibility and processing power to handle complex algorithms and control tasks.
  • Consumer Electronics: Used in high-definition multimedia interfaces (HDMI) and video processing equipment, enabling enhanced video and image quality and faster processing speeds for consumer devices.
  • Medical Devices: Integral to the design of medical imaging equipment such as MRI and ultrasound scanners, facilitating the rapid and accurate processing of imaging data for diagnostics.
This HTML content segments the product description into a clear overview, detailed features, and diverse applications, catering to B2B clients by emphasizing the AMD Xilinx FPGA’s capabilities and potential uses across various industries.
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