XA3S1200E-4FTG256Q
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- Mfr.Part #
- XA3S1200E-4FTG256Q
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FTBGA
- Stock
- 1,707
- In Stock ：
- 1,707
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Pitch :
- 1mm
- Number of CLBs :
- 2168
- Base Part Number :
- XA3S1200E
- Number of Pins :
- 256
- Package / Case :
- 256-LBGA
- Power Supplies :
- 1.21.2/3.32.5V
- Mount :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 516096
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~125°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 190
- Series :
- Automotive, AEC-Q100, Spartan®-3E XA
- Length :
- 17mm
- Number of LABs/CLBs :
- 8672
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 256
- ECCN Code :
- EAR99
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Published :
- 2007
- Number of Outputs :
- 150
- RAM Size :
- 63kB
- Height Seated (Max) :
- 1.55mm
- Number of Gates :
- 1200000
- Terminal Form :
- Ball
- Factory Lead Time :
- 10 Weeks
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 1.2V
- Operating Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 19512
- RoHS Status :
- ROHS3 Compliant
- Pbfree Code :
- yes
- Clock Frequency :
- 572MHz
- Speed Grade :
- 4
- JESD-609 Code :
- e1
- Pin Count :
- 256
- Peak Reflow Temperature (Cel) :
- 260
- Datasheets
- XA3S1200E-4FTG256Q
FPGAs AMD Xilinx XA3S1200E-4FTG256Q Overview
The FPGAs AMD Xilinx XA3S1200E-4FTG256Q represents a cutting-edge solution within the field of programmable logic devices. Engineered by AMD Xilinx, a leader in this innovative technology, this FPGA (Field Programmable Gate Array) is designed to deliver high performance, flexibility, and the capacity for complex digital systems integration. This model is packaged in a compact 256FTBGA configuration, providing ample I/O resources with 190 pins available for multifaceted applications. Ideal for designers looking to push the boundaries of hardware acceleration and smart computing, the XA3S1200E-4FTG256Q serves as a robust platform for developing sophisticated electronic systems.
XA3S1200E-4FTG256Q Features
The XA3S1200E-4FTG256Q FPGA includes several features that make it an excellent choice for both intricate, high-speed digital processing and prototype development. Key features include its high I/O pin count, adaptable logic blocks for customized circuit design, and a secure 256-ball fine pitch ball grid array (FBGA) package that ensures a compact footprint with reliable connectivity. Additionally, this FPGA supports various configuration options allowing for versatile implementations in different hardware environments.
XA3S1200E-4FTG256Q Applications
- Telecommunications Equipment: This FPGA can be used to develop advanced communication protocols and manage multiple data streams effectively, enhancing bandwidth and reducing latency in networks.
- Automotive Systems: Applied in driver assistance systems (ADAS), the XA3S1200E-4FTG256Q facilitates real-time sensor data processing, helping to increase automotive safety and performance.
- Consumer Electronics: Ideal for high-definition multimedia interfaces and interactive devices, this FPGA offers the necessary speed and flexibility for video processing and user interface enhancements.
- Industrial Automation: In factory settings, this chip can control machinery with precise timing and logic customization, streamlining production lines and increasing system reliability.
- Aerospace and Defense: Utilized in mission-critical applications, the XA3S1200E-4FTG256Q provides the robustness required for aerospace computing systems and defense electronics, supporting high reliability and extended environmental spec operations.
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