XA3S200-4TQG144I

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Mfr.Part #
XA3S200-4TQG144I
Manufacturer
AMD Xilinx
Package / Case
144-LQFP
Datasheet
Download
Description
IC FPGA 97 I/O 144TQFP
Stock
34,678
In Stock :
34,678

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
1.2V
Number of Gates :
200000
Terminal Position :
QUAD
Number of Terminations :
144
Length :
20mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
EAR99
Terminal Finish :
Matte Tin (Sn)
Series :
Automotive, AEC-Q100, Spartan®-3 XA
Terminal Form :
Gull wing
Operating Temperature :
-40°C~100°C TJ
Number of Pins :
144
Total RAM Bits :
221184
Mounting Type :
Surface Mount
Published :
2002
Number of LABs/CLBs :
480
Packaging :
Tray
Radiation Hardening :
No
Speed Grade :
4
Number of CLBs :
480
Pin Count :
144
Clock Frequency :
125MHz
Operating Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
XA3S200
Number of Logic Elements/Cells :
4320
RAM Size :
27kB
Mount :
Surface Mount
RoHS Status :
RoHS Compliant
JESD-609 Code :
e3
Width :
20mm
Voltage - Supply :
1.14V~1.26V
Number of I/O :
97
Height Seated (Max) :
1.6mm
Terminal Pitch :
0.5mm
Package / Case :
144-LQFP
Power Supplies :
1.21.2/3.32.5V
Number of Outputs :
173
Datasheets
XA3S200-4TQG144I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA3S200-4TQG144I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:144, Operating Temperature:-40°C~100°C TJ, Number of Pins:144, Mounting Type:Surface Mount, Base Part Number:XA3S200, Package / Case:144-LQFP, XA3S200-4TQG144I pinout, XA3S200-4TQG144I datasheet PDF, XA3S200-4TQG144I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA3S200-4TQG144I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA3S200-4TQG144I


FPGAs AMD Xilinx XA3S200-4TQG144I Overview

The FPGAs AMD Xilinx XA3S200-4TQG144I is a high-performance, programmable gate array designed to meet the needs of demanding applications. This integrated circuit, featuring a robust 144TQFP package, is tailored to facilitate complex digital computations and signal processing tasks efficiently. The device is ideal for developers looking for a blend of versatility, power efficiency, and high-speed performance. Its extensive I/O capabilities make it particularly suitable for multi-faceted design projects requiring a flexible and adaptable hardware environment. By integrating this FPGA into your development, you ensure scalability and adaptability of your hardware solutions, making it an excellent choice for cutting-edge and legacy systems alike.

XA3S200-4TQG144I Features

The XA3S200-4TQG144I from AMD Xilinx offers a robust suite of features including a total of 97 I/O pins, which allow for flexible interfacing with a wide range of peripherals and other digital systems. This FPGA also boasts a compact 144TQFP packaging, which ensures a reduced footprint on system boards, crucial for modern electronic devices that demand minimal space occupation. Enhanced with high reliability and extended temperature ranges, this component is designed to perform in the most challenging environments, making it a reliable choice for critical applications.

XA3S200-4TQG144I Applications

  • Automotive Driver Assistance Systems: Utilized in vehicle sensor interfaces and real-time processing for advanced driver-assistance systems (ADAS), enhancing safety and performance on the road.
  • Industrial Automation: Employs its robust I/O capabilities in control systems for real-time automation and monitoring, optimizing production processes and efficiency.
  • Consumer Electronics: Integral to the development of consumer electronics, such as gaming consoles and high-definition televisions, providing the necessary processing power for enhanced user experiences.
  • Telecommunications: Critical in the deployment of telecommunications infrastructure, supporting complex algorithms required for signal processing and data transmission.
  • Medical Devices: Applies its advanced computational capabilities to medical imaging and diagnostic equipment, enabling faster and more accurate patient diagnostics.
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