SPC5777CCK3MME3

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Published :

2012

Voltage - Supply (Vcc/Vdd) :

3V~5.5V

RAM (bytes) :

524288

Package / Case :

416-BGA

Supply Voltage-Max (Vsup) :

1.32V

Data Converter :

A/D 16b Sigma-Delta, eQADC

Has ADC :

yes

Terminal Pitch :

1mm

DAC Channels :

No

Program Memory Size :

8MB 8M x 8

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Min (Vsup) :

1.2V

RAM Size :

512K x 8

JESD-30 Code :

S-PBGA-B416

Width :

27mm

Height Seated (Max) :

2.02mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

Length :

27mm

Terminal Position :

BOTTOM

Factory Lead Time :

16 Weeks

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Series :

MPC57xx

DMA Channels :

yes

Speed :

264MHz

Peripherals :

DMA, LVD, POR, Zipwire

Surface Mount :

yes

Additional Feature :

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

PWM Channels :

yes

Terminal Form :

Ball

Oscillator Type :

Internal

Core Processor :

e200z7

Connectivity :

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

Number of Terminations :

416

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~125°C TA

HTS Code :

8542.31.00.01

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

ECCN Code :

5A992

Program Memory Type :

Flash

ROM (words) :

8388608

Clock Frequency :

40MHz

Bit Size :

32

On Chip Program ROM Width :

8

Core Size :

32-Bit Tri-Core