S9S08SG8E2MTGR

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

DAC Channels :

No

Published :

1999

Program Memory Type :

Flash

Core Size :

8-Bit

Has ADC :

yes

Power Supplies :

3/5V

Clock Frequency :

16MHz

JESD-609 Code :

e3

Program Memory Size :

8KB 8K x 8

PWM Channels :

yes

Terminal Form :

Gull wing

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

HTS Code :

8542.31.00.01

Bit Size :

8

Oscillator Type :

Internal

RAM (bytes) :

512

Terminal Pitch :

0.65mm

Series :

S08

Number of Terminations :

16

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

Speed :

40MHz

Data Converter :

A/D 8x10b

DMA Channels :

No

Number of I/O :

12

Supply Voltage-Min (Vsup) :

2.7V

Qualification Status :

Not Qualified

Length :

5mm

Screening Level :

AEC-Q100

Terminal Position :

Dual

Height Seated (Max) :

1.2mm

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Terminal Finish :

MATTE TIN

Mounting Type :

Surface Mount

Peripherals :

LVD, POR, PWM, WDT

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tape and Reel (TR)

JESD-30 Code :

R-PDSO-G16

RoHS Status :

ROHS3 Compliant

Supply Voltage-Max (Vsup) :

5.5V

Supply Voltage :

5V

ECCN Code :

EAR99

RAM Size :

512 x 8

Width :

4.4mm

ROM (words) :

8192

Factory Lead Time :

12 Weeks

Operating Temperature :

-40°C~125°C TA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Time@Peak Reflow Temperature-Max (s) :

40

Package / Case :

16-TSSOP (0.173, 4.40mm Width)