S9S08DZ60F2MLCR

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Program Memory Size :

60KB 60K x 8

Factory Lead Time :

12 Weeks

Width :

7mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Published :

1996

Core Size :

8-Bit

Length :

7mm

Terminal Position :

QUAD

Oscillator Type :

External

Number of I/O :

25

PWM Channels :

yes

Supply Voltage :

3V

Peak Reflow Temperature (Cel) :

260

Speed :

40MHz

Supply Voltage-Max (Vsup) :

5.5V

Time@Peak Reflow Temperature-Max (s) :

40

Program Memory Type :

Flash

DMA Channels :

No

Surface Mount :

yes

EEPROM Size :

2K x 8

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Package / Case :

32-LQFP

RAM Size :

4K x 8

Peripherals :

LVD, POR, PWM, WDT

Terminal Pitch :

0.8mm

Operating Temperature :

-40°C~125°C TA

Mounting Type :

Surface Mount

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Packaging :

Tape and Reel (TR)

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Clock Frequency :

20MHz

Data Converter :

A/D 10x12b

RoHS Status :

ROHS3 Compliant

Bit Size :

8

Number of Terminations :

32

Series :

S08

Terminal Form :

Gull wing

Has ADC :

yes

Supply Voltage-Min (Vsup) :

2.7V