PIC16LC622-04E/SO

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Mfr.Part #
PIC16LC622-04E/SO
Manufacturer
Microchip Technology
Package / Case
18-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MCU 8BIT 3.5KB OTP 18SOIC
Stock
48,486
In Stock :
48,486

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Time@Peak Reflow Temperature-Max (s) :
40
Package / Case :
18-SOIC (0.295, 7.50mm Width)
Number of I/O :
13
DMA Channels :
No
Data Bus Width :
8B
Product Status :
Obsolete
Memory Size :
2kB
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
DAC Channels :
No
Packaging :
Tube
Program Memory Size :
3.5KB 2K x 14
RoHS Status :
ROHS3 Compliant
Supply Current-Max :
2mA
Max Power Dissipation :
1W
Supply Voltage-Min (Vsup) :
2.5V
Terminal Pitch :
1.27mm
Terminal Position :
Dual
On Chip Program ROM Width :
14
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Supply Voltage-Max (Vsup) :
6V
Has ADC :
No
CPU Family :
PIC
Lead Free :
Lead Free
RAM Size :
128 x 8
Supply Voltage :
5V
Published :
2003
Package :
Tube
Bit Size :
8
PWM Channels :
No
EEPROM Size :
--
Access Time :
4 µs
Terminal Finish :
Matte Tin (Sn)
JESD-609 Code :
e3
Voltage - Supply (Vcc/Vdd) :
2.5V~6V
Series :
PIC® 16C
Base Part Number :
PIC16LC622
Connectivity :
--
Program Memory Type :
OTP
Watchdog Timer :
yes
Memory Type :
EPROM
Number of Timers/Counters :
8
Operating Temperature :
-40°C~125°C TA
Data Converters :
--
Pin Count :
18
Supplier Device Package :
18-SOIC
Radiation Hardening :
No
Core Size :
8-Bit
Peripherals :
Brown-out Detect/Reset, POR, WDT
Number of Terminations :
18
Pbfree Code :
yes
Speed :
4MHz
Frequency :
4MHz
Height Seated (Max) :
2.64mm
Length :
11.53mm
Mounting Type :
Surface Mount
Surface Mount :
yes
Base Product Number :
PIC16LC622
Peak Reflow Temperature (Cel) :
260
Core Processor :
PIC
Power Supplies :
3/5V
Terminal Form :
Gull wing
Oscillator Type :
External
Datasheets
PIC16LC622-04E/SO
Introducing Microcontrollers Microchip Technology PIC16LC622-04E/SO from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:18-SOIC (0.295, 7.50mm Width), Base Part Number:PIC16LC622, Operating Temperature:-40°C~125°C TA, Number of Terminations:18, Mounting Type:Surface Mount, PIC16LC622-04E/SO pinout, PIC16LC622-04E/SO datasheet PDF, PIC16LC622-04E/SO amp .Beyond Microcontrollers Microchip Technology PIC16LC622-04E/SO ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC16LC622-04E/SO


Microcontrollers Microchip Technology PIC16LC622-04E/SO Overview

The Microcontrollers Microchip Technology PIC16LC622-04E/SO is a high-performance, 8-bit microcontroller that combines intelligent peripheral integration and ease of use to meet a broad range of application requirements. Manufactured by Microchip Technology, this MCU is designed to offer reliable and robust performance with its 3.5KB of OTP memory, making it ideal for a variety of complex digital tasks. The compact 18SOIC package ensures minimal footprint on your circuit boards, while providing powerful capabilities for advanced control systems.

PIC16LC622-04E/SO Features

  • 8-bit microcontroller architecture for efficient control and processing.
  • 3.5KB of OTP memory, suitable for one-time programmable applications.
  • Low-power consumption design, ideal for battery-operated devices.
  • Wide operating voltage range, accommodating various power supplies.
  • Comprehensive set of peripherals including timers, I/O ports, and serial communication interfaces.
  • Compact 18SOIC package for streamlined board integration.

PIC16LC622-04E/SO Applications

  • Consumer Electronics: Utilized in devices like remote controls and gaming consoles for efficient and responsive user interface control.
  • Automotive Applications: Serves in car entertainment systems for robust and reliable performance under varying conditions.
  • Industrial Control: Employed in automated control systems for precise and reliable process management.
  • Home Automation Systems: Integral to smart home devices, facilitating seamless automation and connectivity.
  • Telecommunication Equipment: Used in communication infrastructure to enhance data processing and device interoperability.
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