PIC16LC622-04E/SO

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Mfr.Part #
PIC16LC622-04E/SO
Manufacturer
Microchip Technology
Package / Case
18-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MCU 8BIT 3.5KB OTP 18SOIC
Stock
48,486
In Stock :
48,486

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Published :
2003
Packaging :
Tube
Program Memory Size :
3.5KB 2K x 14
Terminal Pitch :
1.27mm
Number of Terminations :
18
Operating Temperature :
-40°C~125°C TA
Supply Voltage :
5V
Bit Size :
8
Memory Type :
EPROM
Core Size :
8-Bit
Radiation Hardening :
No
Peripherals :
Brown-out Detect/Reset, POR, WDT
CPU Family :
PIC
RAM Size :
128 x 8
Number of Timers/Counters :
8
Oscillator Type :
External
Connectivity :
--
DAC Channels :
No
DMA Channels :
No
PWM Channels :
No
Has ADC :
No
Number of I/O :
13
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Product Status :
Obsolete
Frequency :
4MHz
Max Power Dissipation :
1W
Program Memory Type :
OTP
Height Seated (Max) :
2.64mm
RoHS Status :
ROHS3 Compliant
Core Processor :
PIC
Mounting Type :
Surface Mount
Length :
11.53mm
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Series :
PIC® 16C
Package / Case :
18-SOIC (0.295, 7.50mm Width)
Surface Mount :
yes
Voltage - Supply (Vcc/Vdd) :
2.5V~6V
Data Bus Width :
8B
Package :
Tube
Supply Voltage-Min (Vsup) :
2.5V
Supply Current-Max :
2mA
Base Part Number :
PIC16LC622
Pin Count :
18
EEPROM Size :
--
Lead Free :
Lead Free
On Chip Program ROM Width :
14
Pbfree Code :
yes
JESD-609 Code :
e3
Terminal Form :
Gull wing
Access Time :
4 µs
Terminal Position :
Dual
Power Supplies :
3/5V
Base Product Number :
PIC16LC622
Data Converters :
--
Supply Voltage-Max (Vsup) :
6V
Terminal Finish :
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) :
40
Watchdog Timer :
yes
Speed :
4MHz
Memory Size :
2kB
Peak Reflow Temperature (Cel) :
260
Supplier Device Package :
18-SOIC
Introducing Microcontrollers Microchip Technology PIC16LC622-04E/SO from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:18, Operating Temperature:-40°C~125°C TA, Mounting Type:Surface Mount, Package / Case:18-SOIC (0.295, 7.50mm Width), Base Part Number:PIC16LC622, PIC16LC622-04E/SO pinout, PIC16LC622-04E/SO datasheet PDF, PIC16LC622-04E/SO amp .Beyond Microcontrollers Microchip Technology PIC16LC622-04E/SO ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC16LC622-04E/SO


Microcontrollers Microchip Technology PIC16LC622-04E/SO Overview

The Microcontrollers Microchip Technology PIC16LC622-04E/SO is a high-performance, 8-bit microcontroller that combines intelligent peripheral integration and ease of use to meet a broad range of application requirements. Manufactured by Microchip Technology, this MCU is designed to offer reliable and robust performance with its 3.5KB of OTP memory, making it ideal for a variety of complex digital tasks. The compact 18SOIC package ensures minimal footprint on your circuit boards, while providing powerful capabilities for advanced control systems.

PIC16LC622-04E/SO Features

  • 8-bit microcontroller architecture for efficient control and processing.
  • 3.5KB of OTP memory, suitable for one-time programmable applications.
  • Low-power consumption design, ideal for battery-operated devices.
  • Wide operating voltage range, accommodating various power supplies.
  • Comprehensive set of peripherals including timers, I/O ports, and serial communication interfaces.
  • Compact 18SOIC package for streamlined board integration.

PIC16LC622-04E/SO Applications

  • Consumer Electronics: Utilized in devices like remote controls and gaming consoles for efficient and responsive user interface control.
  • Automotive Applications: Serves in car entertainment systems for robust and reliable performance under varying conditions.
  • Industrial Control: Employed in automated control systems for precise and reliable process management.
  • Home Automation Systems: Integral to smart home devices, facilitating seamless automation and connectivity.
  • Telecommunication Equipment: Used in communication infrastructure to enhance data processing and device interoperability.
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