MT47H64M8SH-25E AAT:H TR

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Mfr.Part #
MT47H64M8SH-25E AAT:H TR
Manufacturer
Micron Technology
Package / Case
60-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 60FBGA
Stock
25,539
In Stock :
25,539

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Type :
Volatile
Voltage - Supply :
1.7V~1.9V
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~105°C TA
Memory Interface :
Parallel
Packaging :
Tape and Reel (TR)
Memory Format :
DRAM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
512Mb 64M x 8
RoHS Status :
ROHS3 Compliant
Write Cycle Time - Word, Page :
15ns
Clock Frequency :
400MHz
Package / Case :
60-TFBGA
Access Time :
400ps
Introducing Memory Micron Technology MT47H64M8SH-25E AAT:H TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~105°C TA, Package / Case:60-TFBGA, MT47H64M8SH-25E AAT:H TR pinout, MT47H64M8SH-25E AAT:H TR datasheet PDF, MT47H64M8SH-25E AAT:H TR amp .Beyond Memory Micron Technology MT47H64M8SH-25E AAT:H TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H64M8SH-25E AAT:H TR


Memory Micron Technology MT47H64M8SH-25E AAT:H TR Overview

The Memory Micron Technology MT47H64M8SH-25E AAT:H TR is a high-performance 512Mbit DRAM integrated circuit, meticulously crafted to meet the stringent demands of modern electronic devices. Manufactured by Micron Technology, this IC features a parallel interface and is encapsulated in a compact 60FBGA package, designed to provide optimal reliability and functionality across a wide range of applications. This product stands out in the marketplace for its ability to deliver high-speed data transmission and low power consumption, making it an ideal choice for businesses looking to purchase high-quality memory components in bulk.

MT47H64M8SH-25E AAT:H TR Features

This DRAM IC is renowned for its robust feature set, including a capacity of 512Mbit with a parallel data interface that ensures rapid access and processing speeds. The 60FBGA packaging not only minimizes space on the circuit board but also enhances the thermal and mechanical reliability of the device. Furthermore, the IC is engineered for low power consumption, which is crucial for extending the battery life of portable devices and reducing energy costs in large-scale systems.

MT47H64M8SH-25E AAT:H TR Applications

  • Mobile Phones: Utilized in the memory modules of smartphones to manage multiple applications simultaneously without compromising performance.
  • Computing Devices: Acts as system memory in personal computers, laptops, and servers, where high data bandwidth and capacity are essential for efficient operation.
  • Embedded Systems: Serves as crucial memory components in embedded systems for automotive and industrial applications, providing the necessary robustness and endurance.
  • Consumer Electronics: Integrated into devices such as tablets and gaming consoles to ensure smooth multimedia playback and gaming experiences.
  • Telecommunications Equipment: Deployed in telecommunications infrastructure to enhance data processing capabilities and support complex operations and services.
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Shipping Cost

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