MT47H64M8CB-3:B TR

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Mfr.Part #
MT47H64M8CB-3:B TR
Manufacturer
Micron Technology
Package / Case
60-FBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 60FBGA
Stock
20,628
In Stock :
20,628

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Manufacturer :
Micron Technology
Product Category :
Memory
Operating Temperature :
0°C~85°C TC
Mounting Type :
Surface Mount
Access Time :
450ps
Memory Size :
512Mb 64M x 8
RoHS Status :
ROHS3 Compliant
Write Cycle Time - Word, Page :
15ns
Packaging :
Tape and Reel (TR)
Voltage - Supply :
1.7V~1.9V
Published :
2006
Memory Format :
DRAM
Base Part Number :
MT47H64M8
Package / Case :
60-FBGA
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Clock Frequency :
333MHz
Memory Type :
Volatile
Introducing Memory Micron Technology MT47H64M8CB-3:B TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TC, Mounting Type:Surface Mount, Base Part Number:MT47H64M8, Package / Case:60-FBGA, MT47H64M8CB-3:B TR pinout, MT47H64M8CB-3:B TR datasheet PDF, MT47H64M8CB-3:B TR amp .Beyond Memory Micron Technology MT47H64M8CB-3:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H64M8CB-3:B TR


Memory Micron Technology MT47H64M8CB-3:B TR Overview

Introducing the Memory Micron Technology MT47H64M8CB-3:B TR, a high-performance IC DRAM designed to meet the demanding needs of advanced electronic systems. This 512Mbit DRAM from Micron Technology is encapsulated in a compact 60FBGA package, ensuring robust performance in a minimal footprint. Ideal for applications requiring high-speed data processing and storage, this product offers reliability and enhanced data integrity, making it a top choice for industry leaders seeking to optimize their electronic solutions.

MT47H64M8CB-3:B TR Features

  • High Density: 512Mbit capacity enables substantial data management and storage capabilities.
  • Parallel Interface: Facilitates fast data transfer rates, suitable for high-performance computing environments.
  • Compact Form Factor: The 60FBGA package allows for efficient space utilization in complex PCB designs.
  • Low Power Consumption: Optimized power management contributes to greater energy efficiency in applications.

MT47H64M8CB-3:B TR Applications

  • Mobile Devices: Utilized in smartphones and tablets to manage functions such as multitasking and media playback, enhancing device performance and user experience.
  • Personal Computers: Employs in desktops and laptops for increased memory capacity, supporting more robust software applications and user interfaces.
  • Automotive Systems: Integrated into vehicle infotainment and navigation systems, providing the necessary speed and capacity for real-time data processing.
  • Networking Equipment: Used in routers and switches to maintain fast data throughput and efficient handling of multiple data streams.
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