MT47H64M16HR-3 L:G TR
- Mfr.Part #
- MT47H64M16HR-3 L:G TR
- Manufacturer
- Micron Technology
- Package / Case
- 84-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 1GBIT PARALLEL 84FBGA
- Stock
- 11,785
- In Stock :
- 11,785
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- 0°C~85°C TC
- Memory Size :
- 1Gb 64M x 16
- Mounting Type :
- Surface Mount
- Supplier Device Package :
- 84-FBGA (8x12.5)
- Base Part Number :
- MT47H64M16
- Write Cycle Time - Word, Page :
- 15ns
- Access Time :
- 450ps
- Memory Interface :
- Parallel
- Memory Type :
- Volatile
- Memory Format :
- DRAM
- Voltage - Supply :
- 1.7V~1.9V
- Package / Case :
- 84-TFBGA
- Packaging :
- Tape and Reel (TR)
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 333MHz
- Published :
- 2010
- Datasheets
- MT47H64M16HR-3 L:G TR

Memory Micron Technology MT47H64M16HR-3 L:G TR Overview
The Memory Micron Technology MT47H64M16HR-3 L:G TR DRAM module represents a high-performance memory solution designed to meet the rigorous demands of advanced computing systems. Engineered by Micron Technology, a leader in integrated memory technologies, this product offers a substantial 1 Gigabit capacity within a compact 84-ball fine-pitch ball grid array (FBGA) package. Optimized for efficient data throughput and stability, this DRAM module ensures reliable operation in a variety of sophisticated electronic environments. The integration of cutting-edge technology with Micron's rigorous quality assurance processes makes this memory module an ideal choice for manufacturers looking to enhance system performance and reliability.
MT47H64M16HR-3 L:G TR Features
The MT47H64M16HR-3 L:G TR features include high-speed data transfer rates and a parallel interface, facilitating quick and efficient processing capabilities essential for modern applications. Its low-latency response is suited for performance-critical applications, ensuring that systems operate smoothly and reliably. Additionally, the module's compact FBGA packaging allows for high-density memory integration, minimizing PCB space and enabling sleeker, more compact device designs.
MT47H64M16HR-3 L:G TR Applications
- Computing Systems: Utilized in desktops, laptops, and servers for enhanced multitasking and improved system responsiveness.
- Mobile Devices: Integrated into smartphones and tablets to manage multiple applications simultaneously without compromising performance.
- Gaming Consoles: Provides the high-speed memory required for complex graphics and rapid game loading times.
- Telecommunications: Used in networking hardware such as routers and switches, facilitating efficient data flow and high-speed communications.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time data for vehicle safety enhancements.
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