MT47H32M16CC-3:B

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Mfr.Part #
MT47H32M16CC-3:B
Manufacturer
Micron Technology
Package / Case
84-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 84FBGA
Stock
19,001
In Stock :
19,001

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Manufacturer :
Micron Technology
Product Category :
Memory
Interleaved Burst Length :
48
Supply Voltage-Min (Vsup) :
1.7V
Sequential Burst Length :
48
Number of Functions :
1
Packaging :
Tray
Density :
512 Mb
HTS Code :
8542.32.00.28
Memory Interface :
Parallel
Height Seated (Max) :
1.2mm
ECCN Code :
EAR99
Time@Peak Reflow Temperature-Max (s) :
30
Output Characteristics :
3-STATE
Mount :
Surface Mount
Memory Format :
DRAM
Lead Free :
Lead Free
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Length :
12.5mm
Radiation Hardening :
No
Peak Reflow Temperature (Cel) :
260
Additional Feature :
AUTO/SELF REFRESH
Terminal Position :
BOTTOM
Terminal Finish :
TIN SILVER COPPER
Package / Case :
84-TFBGA
Standby Current-Max :
0.007A
Write Cycle Time - Word, Page :
15ns
Memory Size :
512Mb 32M x 16
Voltage - Supply :
1.7V~1.9V
JESD-609 Code :
e1
Pin Count :
84
RoHS Status :
ROHS3 Compliant
Base Part Number :
MT47H32M16
Data Bus Width :
16b
Organization :
32MX16
Nominal Supply Current :
250mA
Operating Temperature :
0°C~85°C TC
Number of Terminations :
84
Number of Ports :
1
Operating Supply Voltage :
1.8V
Clock Frequency :
333MHz
Memory Type :
Volatile
Access Time :
450ps
Memory Width :
16
Mounting Type :
Surface Mount
Supply Voltage :
1.8V
Address Bus Width :
15b
I/O Type :
COMMON
Refresh Cycles :
8192
Published :
2006
Supply Voltage-Max (Vsup) :
1.9V
Number of Pins :
84
Terminal Pitch :
0.8mm
Datasheets
MT47H32M16CC-3:B
Introducing Memory Micron Technology MT47H32M16CC-3:B from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:84-TFBGA, Base Part Number:MT47H32M16, Operating Temperature:0°C~85°C TC, Number of Terminations:84, Mounting Type:Surface Mount, Number of Pins:84, MT47H32M16CC-3:B pinout, MT47H32M16CC-3:B datasheet PDF, MT47H32M16CC-3:B amp .Beyond Memory Micron Technology MT47H32M16CC-3:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H32M16CC-3:B


Memory Micron Technology MT47H32M16CC-3:B Overview

The Memory Micron Technology MT47H32M16CC-3:B is a high-performance IC DRAM featuring a 512Mbit capacity and a compact 84FBGA package. Designed for applications requiring dense memory storage and fast data retrieval, this product harnesses Micron's cutting-edge technology to deliver exceptional speed and reliability. Ideal for advanced computing and high-speed processing tasks, the Memory Micron Technology MT47H32M16CC-3:B ensures optimal performance in demanding environments, making it a prime choice for B2B clients aiming to leverage robust memory solutions in their products.

MT47H32M16CC-3:B Features

This 512Mbit DRAM from Micron Technology boasts several key features that make it a competitive choice in the market:

  • High Storage Capacity: With 512Mbit of memory, it offers ample space for demanding applications.
  • Parallel Interface: Facilitates rapid data transfer rates which are crucial for high-performance computing tasks.
  • Compact Form Factor: The 84FBGA package ensures a minimal footprint, ideal for devices where space is at a premium.
  • Reliable Performance: Engineered by Micron Technology, known for its innovation and quality in memory products.

MT47H32M16CC-3:B Applications

  • Smartphones and Tablets: Utilized for managing the extensive memory requirements and multitasking environments, ensuring smooth operation and user experience.
  • Personal Computers: Improves system responsiveness and allows for efficient handling of large-scale software applications.
  • Embedded Systems: Provides the necessary memory backbone for embedded systems in automotive and industrial applications, enhancing performance and reliability.
  • Gaming Consoles: Ensures fast loading times and real-time game data processing, which is critical for modern gaming experiences.
  • Networking Equipment: Supports advanced networking hardware by facilitating quick data exchange and buffer management, crucial for high-speed network environments.
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Shipping Cost

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