MT47H128M8CF-3:H

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Mfr.Part #
MT47H128M8CF-3:H
Manufacturer
Micron Technology
Package / Case
60-TFBGA
Datasheet
Download
Description
IC DRAM 1GBIT PARALLEL 60FBGA
Stock
34,831
In Stock :
34,831

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Interface :
Parallel
Peak Reflow Temperature (Cel) :
260
Number of Ports :
1
Write Cycle Time - Word, Page :
15ns
Max Frequency :
667MHz
Pin Count :
60
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Sequential Burst Length :
48
Length :
10mm
Lead Free :
Lead Free
Terminal Pitch :
0.8mm
Terminal Position :
BOTTOM
Supply Voltage-Min (Vsup) :
1.7V
Number of Terminations :
60
Mounting Type :
Surface Mount
Interleaved Burst Length :
48
Density :
1 Gb
Voltage - Supply :
1.7V~1.9V
Supply Voltage-Max (Vsup) :
1.9V
Package / Case :
60-TFBGA
Nominal Supply Current :
115mA
I/O Type :
COMMON
Height Seated (Max) :
1.2mm
Published :
2008
Memory Size :
1Gb 128M x 8
Organization :
128MX8
Additional Feature :
AUTO/SELF REFRESH
Radiation Hardening :
No
Time@Peak Reflow Temperature-Max (s) :
30
Output Characteristics :
3-STATE
Base Part Number :
MT47H128M8
Memory Format :
DRAM
ECCN Code :
EAR99
Operating Temperature :
0°C~85°C TC
Number of Pins :
60
Clock Frequency :
333MHz
Supply Voltage :
1.8V
Operating Supply Voltage :
1.8V
Memory Width :
8
Contact Plating :
Copper, Silver, Tin
Memory Type :
Volatile
RoHS Status :
ROHS3 Compliant
Pbfree Code :
yes
Number of Functions :
1
JESD-609 Code :
e1
Access Time :
450ps
Packaging :
Tray
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Data Bus Width :
8B
Mount :
Surface Mount
Address Bus Width :
17b
HTS Code :
8542.32.00.32
Refresh Cycles :
8192
Datasheets
MT47H128M8CF-3:H
Introducing Memory Micron Technology MT47H128M8CF-3:H from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:60, Mounting Type:Surface Mount, Package / Case:60-TFBGA, Base Part Number:MT47H128M8, Operating Temperature:0°C~85°C TC, Number of Pins:60, MT47H128M8CF-3:H pinout, MT47H128M8CF-3:H datasheet PDF, MT47H128M8CF-3:H amp .Beyond Memory Micron Technology MT47H128M8CF-3:H ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H128M8CF-3:H


Memory Micron Technology MT47H128M8CF-3:H Overview

The Memory Micron Technology MT47H128M8CF-3:H is a high-performance Integrated Circuit (IC) DRAM that offers a substantial 1Gbit capacity, designed to meet the intense demands of high-speed computing and advanced digital applications. Developed by Micron Technology, a leader in memory and storage solutions, this IC DRAM is encapsulated in a compact 60-ball fine-pitch ball grid array (FBGA) package, ensuring a minimal footprint on system boards. Its optimal design and efficiency make it ideal for manufacturers looking to enhance their systems with reliable and robust memory performance, thus driving interest in bulk purchases for B2B clients.

MT47H128M8CF-3:H Features

The MT47H128M8CF-3:H IC DRAM boasts features suitable for a broad spectrum of high-demand applications, including advanced error correction, high data transfer rates, and low-power consumption. Its 1Gbit density allows for extensive data storage and quick access, facilitating improved device performance and user experience.

MT47H128M8CF-3:H Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computing systems where large memory bandwidth and capacity are necessary for handling large datasets and complex calculations.
  • Consumer Electronics: Applied in consumer electronics such as high-definition televisions and gaming consoles, where its high-speed data transfer capabilities enhance the overall multimedia experience.
  • Mobile Devices: Used in smartphones and tablets, offering the necessary memory capacity and efficiency for running multiple applications simultaneously and smoothly.
  • Networking Hardware: Integral for switches and routers, facilitating the processing of large amounts of data with minimal latency, thus maintaining robust network performance.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) and infotainment systems in vehicles, providing the reliability and endurance required in automotive environments.
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Shipping Cost

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