MT47H128M4CF-187E:G

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Mfr.Part #
MT47H128M4CF-187E:G
Manufacturer
Micron Technology
Package / Case
60-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 60FBGA
Stock
1,434
In Stock :
1,434

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Manufacturer :
Micron Technology
Product Category :
Memory
Mounting Type :
Surface Mount
Terminal Pitch :
0.8mm
Package / Case :
60-TFBGA
Radiation Hardening :
No
Pin Count :
60
Number of Terminations :
60
Peak Reflow Temperature (Cel) :
260
Density :
512 Mb
Memory Width :
4
Height Seated (Max) :
1.2mm
Number of Ports :
1
Write Cycle Time - Word, Page :
15ns
Published :
2010
Number of Pins :
60
Pbfree Code :
yes
Length :
10mm
RoHS Status :
ROHS3 Compliant
Lead Free :
Lead Free
Memory Type :
Volatile
ECCN Code :
EAR99
HTS Code :
8542.32.00.28
Max Frequency :
1.066GHz
Clock Frequency :
533MHz
Supply Voltage-Min (Vsup) :
1.7V
Nominal Supply Current :
145mA
Voltage - Supply :
1.7V~1.9V
Mount :
Surface Mount
Memory Format :
DRAM
Packaging :
Tray
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Voltage :
1.8V
Memory Size :
512Mb 128M x 4
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code :
e1
Additional Feature :
AUTO/SELF REFRESH
Number of Functions :
1
Organization :
128MX4
Supply Voltage :
1.8V
Base Part Number :
MT47H128M4
Operating Temperature :
0°C~85°C TC
Address Bus Width :
16b
Access Time :
350ps
Data Bus Width :
4B
Memory Interface :
Parallel
Supply Voltage-Max (Vsup) :
1.9V
Introducing Memory Micron Technology MT47H128M4CF-187E:G from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:60-TFBGA, Number of Terminations:60, Number of Pins:60, Base Part Number:MT47H128M4, Operating Temperature:0°C~85°C TC, MT47H128M4CF-187E:G pinout, MT47H128M4CF-187E:G datasheet PDF, MT47H128M4CF-187E:G amp .Beyond Memory Micron Technology MT47H128M4CF-187E:G ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H128M4CF-187E:G


Memory Micron Technology MT47H128M4CF-187E:G Overview

Introducing the Memory Micron Technology MT47H128M4CF-187E:G, a high-performance DRAM module designed by Micron Technology, tailored for applications requiring extensive data bandwidth and low-latency memory operations. This integrated circuit features a robust 512Mbit capacity housed in a compact 60FBGA package, making it an ideal solution for advanced computing systems. Its efficient parallel interface ensures rapid data access and processing, meeting the rigorous demands of contemporary digital environments. With its superior design and reliability, the Memory Micron Technology MT47H128M4CF-187E:G stands out as a top choice for businesses looking to enhance their technology infrastructure.

MT47H128M4CF-187E:G Features

The MT47H128M4CF-187E:G DRAM boasts several key features that make it a valuable component for any high-demand system:

  • High Capacity: 512Mbit of memory allows for extensive data management and storage.
  • Parallel Interface: Facilitates quick and efficient data handling, enabling high-speed operations.
  • Compact Form Factor: The 60FBGA packaging is designed for minimal space utilization while maximizing functionality.
  • Low Latency: Optimized for applications requiring rapid access to large volumes of data.
  • Reliability: Produced by Micron Technology, known for its durable and dependable memory solutions.

MT47H128M4CF-187E:G Applications

  • Computing Systems: Enhances performance in servers and high-end PCs by providing rapid data access and improved memory density.
  • Networking Equipment: Utilized in routers and switches for efficient packet buffering and data flow management.
  • Consumer Electronics: Integral for advanced consumer electronics, such as gaming consoles and smart TVs, where large memory capacity and speed are necessary for optimal functionality.
  • Industrial Automation: Supports complex operations in automated machinery by allowing for fast processing and real-time data handling.
  • Telecommunications: Employs in telecommunications infrastructure to manage large data loads and enhance system reliability.
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