M2S150TS-1FCV484I
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- Mfr.Part #
- M2S150TS-1FCV484I
- Manufacturer
- Microchip Technology
- Package / Case
- 484-BFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 484FBGA
- Stock
- 10,276
- In Stock ：
- 10,276
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Terminal Pitch :
- 0.8mm
- Height Seated (Max) :
- 3.15mm
- Speed :
- 166MHz
- RAM Size :
- 64KB
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peripherals :
- DDR, PCIe, SERDES
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- RoHS Status :
- Non-RoHS Compliant
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Length :
- 19mm
- JESD-609 Code :
- e0
- Number of Terminations :
- 484
- Architecture :
- MCU, FPGA
- Package / Case :
- 484-BFBGA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- SmartFusion®2
- Supply Voltage :
- 1.2V
- Published :
- 2015
- Supply Voltage-Max (Vsup) :
- 1.26V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Primary Attributes :
- FPGA - 150K Logic Modules
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 10 Weeks
- Pbfree Code :
- No
- Flash Size :
- 512kB
- Width :
- 19mm
- Packaging :
- Tray
- Terminal Form :
- Ball
- Supply Voltage-Min (Vsup) :
- 1.14V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B484
- Core Processor :
- ARM® Cortex®-M3
- Additional Feature :
- LG-MIN, WD-MIN
- Reach Compliance Code :
- not_compliant
- Number of I/O :
- 273
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- M2S150TS-1FCV484I
484 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 273 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 484-BFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 273 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 484 terminations.This flash has a size of 512KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150TS-1FCV484I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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