M2S100-1FCG1152

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Mfr.Part #
M2S100-1FCG1152
Manufacturer
Microsemi
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 166MHZ 1152BGA
Stock
25,885
In Stock :
25,885

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Length :
35mm
Qualification Status :
Not Qualified
Height Seated (Max) :
2.9mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Core Processor :
ARM® Cortex®-M3
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
1152-BBGA, FCBGA
Terminal Position :
BOTTOM
Supply Voltage :
1.2V
Frequency :
166MHz
Published :
2009
Power Supplies :
1.2V
Series :
SmartFusion®2
Peripherals :
DDR, PCIe, SERDES
Core Architecture :
ARM
Number of I/O :
574
Width :
35mm
Architecture :
MCU, FPGA
JESD-30 Code :
S-PBGA-B1152
Primary Attributes :
FPGA - 100K Logic Modules
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Connectivity :
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Packaging :
Tray
RoHS Status :
RoHS Compliant
Flash Size :
512kB
RAM Size :
64KB
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Interface :
CAN, Ethernet, I2C, SPI, UART, USART, USB
Base Part Number :
M2S100
Supply Voltage-Max (Vsup) :
1.26V
Terminal Pitch :
1mm
Operating Temperature :
0°C~85°C TJ
Number of Outputs :
574
Supply Voltage-Min (Vsup) :
1.14V
Number of Logic Cells :
99512
Number of Inputs :
574
Datasheets
M2S100-1FCG1152
Introducing System On Chip (SoC) Microsemi M2S100-1FCG1152 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Base Part Number:M2S100, Operating Temperature:0°C~85°C TJ, M2S100-1FCG1152 pinout, M2S100-1FCG1152 datasheet PDF, M2S100-1FCG1152 amp .Beyond System On Chip (SoC) Microsemi M2S100-1FCG1152 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi M2S100-1FCG1152


0°C~85°C TJ M2S100 System On Chip SmartFusion®2 Series 574 I/O 1.2V

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 1152-BBGA, FCBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 100K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 574.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is possible to use this SoC chip with 574 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 574 inputs is available to the user.99512 logic cells are included in logic system on chips.There is a flash of 512KB.Searching M2S100 will yield system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S100-1FCG1152 System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
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