M2S100-1FC1152
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- Mfr.Part #
- M2S100-1FC1152
- Manufacturer
- Microsemi
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 43,503
- In Stock ：
- 43,503
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- Manufacturer :
- Microsemi
- Product Category :
- System On Chip (SoC)
- Supply Voltage :
- 1.2V
- Flash Size :
- 512kB
- Frequency :
- 166MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- RAM Size :
- 64KB
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1mm
- Width :
- 35mm
- Terminal Finish :
- TIN LEAD
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Length :
- 35mm
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Terminal Form :
- Ball
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- JESD-30 Code :
- S-PBGA-B1152
- Number of Logic Cells :
- 99512
- Primary Attributes :
- FPGA - 100K Logic Modules
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Number of Outputs :
- 574
- Package / Case :
- 1152-BBGA, FCBGA
- Architecture :
- MCU, FPGA
- Core Architecture :
- ARM
- Core Processor :
- ARM® Cortex®-M3
- Number of Inputs :
- 574
- Base Part Number :
- M2S100
- Power Supplies :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Published :
- 2009
- Supply Voltage-Min (Vsup) :
- 1.14V
- Height Seated (Max) :
- 2.9mm
- Series :
- SmartFusion®2
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-609 Code :
- e0
- Number of I/O :
- 574
- Supply Voltage-Max (Vsup) :
- 1.26V
- Peripherals :
- DDR, PCIe, SERDES
- Terminal Position :
- BOTTOM
- Datasheets
- M2S100-1FC1152
0°C~85°C TJ M2S100 System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 100K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.574 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.A SoC chip with 574 outputs is available.A power supply of 1.2V is required.A SoC chip with 574 inputs is available.A logic SoC has 99512 logic cells.A 512KB flash can be seen on it.Search M2S100 for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100-1FC1152 System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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