M2S150TS-1FC1152I
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- Mfr.Part #
- M2S150TS-1FC1152I
- Manufacturer
- Microchip Technology
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 6,964
- In Stock ：
- 6,964
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Core Architecture :
- ARM
- Number of I/O :
- 574
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Supply Voltage-Max (Vsup) :
- 1.26V
- Width :
- 35mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage :
- 1.2V
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- RAM Size :
- 64KB
- Qualification Status :
- Not Qualified
- Primary Attributes :
- FPGA - 150K Logic Modules
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- SmartFusion®2
- Core Processor :
- ARM® Cortex®-M3
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B1152
- JESD-609 Code :
- e0
- Architecture :
- MCU, FPGA
- Peripherals :
- DDR, PCIe, SERDES
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 2.9mm
- Power Supplies :
- 1.2V
- Number of Inputs :
- 574
- Supply Voltage-Min (Vsup) :
- 1.14V
- Frequency :
- 166MHz
- Reach Compliance Code :
- not_compliant
- Surface Mount :
- yes
- Package / Case :
- 1152-BBGA, FCBGA
- Number of Logic Cells :
- 146124
- Flash Size :
- 512kB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Base Part Number :
- M2S150TS
- Length :
- 35mm
- Number of Outputs :
- 574
- Datasheets
- M2S150TS-1FC1152I
-40°C~100°C TJ M2S150TS System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 574 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.Power supply should be at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Using this SoC chip, you have the option of having 574 outputs.There is 1.2V power supply required for system on chip.There are 574 inputs available on the SoC chip.146124 logic cells are present in logic system on chips.The flash is set to 512KB.By searching M2S150TS, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150TS-1FC1152I System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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