M2S150T-1FCG1152
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- Mfr.Part #
- M2S150T-1FCG1152
- Manufacturer
- Microchip Technology
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 16,844
- In Stock ：
- 16,844
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Logic Cells :
- 146124
- Length :
- 35mm
- Surface Mount :
- yes
- Primary Attributes :
- FPGA - 150K Logic Modules
- Qualification Status :
- Not Qualified
- Width :
- 35mm
- Series :
- SmartFusion®2
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- MATTE TIN
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Flash Size :
- 512kB
- Number of I/O :
- 574
- Terminal Pitch :
- 1mm
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 1152-BBGA, FCBGA
- Supply Voltage-Max (Vsup) :
- 1.26V
- Packaging :
- Tray
- RAM Size :
- 64KB
- Number of Outputs :
- 574
- Base Part Number :
- M2S150T
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Number of Inputs :
- 574
- Frequency :
- 166MHz
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Supply Voltage :
- 1.2V
- Core Processor :
- ARM® Cortex®-M3
- Supply Voltage-Min (Vsup) :
- 1.14V
- JESD-609 Code :
- e3
- Factory Lead Time :
- 10 Weeks
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Published :
- 2009
- Architecture :
- MCU, FPGA
- Operating Temperature :
- 0°C~85°C TJ
- Power Supplies :
- 1.2V
- Peripherals :
- DDR, PCIe, SERDES
- JESD-30 Code :
- S-PBGA-B1152
- Height Seated (Max) :
- 2.9mm
- Core Architecture :
- ARM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- RoHS Compliant
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Datasheets
- M2S150T-1FCG1152
0°C~85°C TJ M2S150T System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 574 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.This SoC chip is capable of having 574 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 574 inputs.System on chips of logic are comprised of 146124 logic cells.This flash has a size of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S150T.During operation, the wireless SoC runs at a frequency of 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150T-1FCG1152 System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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