M2S150T-1FC1152
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- Mfr.Part #
- M2S150T-1FC1152
- Manufacturer
- Microchip Technology
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 46,722
- In Stock ：
- 46,722
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Reach Compliance Code :
- not_compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Flash Size :
- 512kB
- Peripherals :
- DDR, PCIe, SERDES
- Operating Temperature :
- -40°C~100°C TJ
- Width :
- 35mm
- JESD-609 Code :
- e0
- Factory Lead Time :
- 10 Weeks
- Published :
- 2009
- RAM Size :
- 64KB
- Core Architecture :
- ARM
- Package / Case :
- 1152-BBGA, FCBGA
- Number of I/O :
- 574
- Architecture :
- MCU, FPGA
- Supply Voltage-Min (Vsup) :
- 1.14V
- Power Supplies :
- 1.2V
- Base Part Number :
- M2S150T
- Terminal Form :
- Ball
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Series :
- SmartFusion®2
- Height Seated (Max) :
- 2.9mm
- Number of Inputs :
- 574
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Primary Attributes :
- FPGA - 150K Logic Modules
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Number of Logic Cells :
- 146124
- Surface Mount :
- yes
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Core Processor :
- ARM® Cortex®-M3
- Supply Voltage-Max (Vsup) :
- 1.26V
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Frequency :
- 166MHz
- Length :
- 35mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B1152
- Number of Outputs :
- 574
- Datasheets
- M2S150T-1FC1152
-40°C~100°C TJ M2S150T System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 150K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.574 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.A SoC chip with 574 outputs is available.A power supply of 1.2V is required.A SoC chip with 574 inputs is available.A logic SoC has 146124 logic cells.A 512KB flash can be seen on it.Search M2S150T for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150T-1FC1152I System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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