M2S150S-1FCG1152I

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Mfr.Part #
M2S150S-1FCG1152I
Manufacturer
Microsemi
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 166MHZ 1152BGA
Stock
27,230
In Stock :
27,230

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Supplier Device Package :
1152-FCBGA (35x35)
Packaging :
Tray
Number of I/O :
574
Series :
SmartFusion®2
RoHS Status :
RoHS Compliant
Speed :
166MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Architecture :
ARM
Package / Case :
1152-BBGA, FCBGA
Operating Temperature :
-40°C~100°C TJ
Frequency :
166MHz
Peripherals :
DDR, PCIe, SERDES
Base Part Number :
M2S150S
Min Operating Temperature :
-40°C
Flash Size :
512kB
RAM Size :
64KB
Interface :
CAN, Ethernet, I2C, SPI, UART, USART, USB
Primary Attributes :
FPGA - 150K Logic Modules
Core Processor :
ARM® Cortex®-M3
Architecture :
MCU, FPGA
Connectivity :
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Max Operating Temperature :
100°C
Datasheets
M2S150S-1FCG1152I
Introducing System On Chip (SoC) Microsemi M2S150S-1FCG1152I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1152-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Base Part Number:M2S150S, M2S150S-1FCG1152I pinout, M2S150S-1FCG1152I datasheet PDF, M2S150S-1FCG1152I amp .Beyond System On Chip (SoC) Microsemi M2S150S-1FCG1152I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi M2S150S-1FCG1152I


-40°C~100°C TJ M2S150S System On Chip SmartFusion®2 Series 574 I/O

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 150K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.574 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search M2S150S for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S150S-1FCG1152I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
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