M2S150-1FCV484I
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- Mfr.Part #
- M2S150-1FCV484I
- Manufacturer
- Microchip Technology
- Package / Case
- 484-BFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 484FBGA
- Stock
- 2,225
- In Stock ：
- 2,225
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Supply Voltage-Max (Vsup) :
- 1.26V
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of Outputs :
- 273
- Architecture :
- MCU, FPGA
- Number of Logic Cells :
- 146124
- Number of I/O :
- 273
- Peripherals :
- DDR, PCIe, SERDES
- Width :
- 19mm
- Power Supplies :
- 1.2V
- Factory Lead Time :
- 12 Weeks
- Package / Case :
- 484-BFBGA
- Surface Mount :
- yes
- Terminal Pitch :
- 0.8mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Speed :
- 166MHz
- Primary Attributes :
- FPGA - 150K Logic Modules
- Height Seated (Max) :
- 3.15mm
- RoHS Status :
- Non-RoHS Compliant
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 484
- Length :
- 19mm
- Number of Inputs :
- 273
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e0
- Core Processor :
- ARM® Cortex®-M3
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Flash Size :
- 512kB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-30 Code :
- S-PBGA-B484
- Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RAM Size :
- 64KB
- Additional Feature :
- LG-MIN, WD-MIN
- Series :
- SmartFusion®2
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Form :
- Ball
- Published :
- 2015
- Qualification Status :
- Not Qualified
- Datasheets
- M2S150-1FCV484I
484 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 273 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 484-BFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 273 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 484 terminations.This SoC chip is capable of having 273 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 273 inputs.System on chips of logic are comprised of 146124 logic cells.This flash has a size of 512KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150-1FCV484I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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