M2S150-1FCS536
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- Mfr.Part #
- M2S150-1FCS536
- Manufacturer
- Microchip Technology
- Package / Case
- 536-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 536BGA
- Stock
- 12,822
- In Stock ：
- 12,822
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Flash Size :
- 512kB
- Operating Temperature :
- 0°C~85°C TJ
- Published :
- 2015
- Package / Case :
- 536-LFBGA, CSPBGA
- Number of Terminations :
- 536
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e0
- Surface Mount :
- yes
- Number of Outputs :
- 293
- Supply Voltage :
- 1.2V
- Packaging :
- Tray
- Primary Attributes :
- FPGA - 150K Logic Modules
- RAM Size :
- 64KB
- Number of Logic Cells :
- 146124
- HTS Code :
- 8542.39.00.01
- Architecture :
- MCU, FPGA
- Peripherals :
- DDR, PCIe, SERDES
- Core Processor :
- ARM® Cortex®-M3
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Reach Compliance Code :
- not_compliant
- Supply Voltage-Min (Vsup) :
- 1.14V
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- JESD-30 Code :
- S-PBGA-B536
- Power Supplies :
- 1.2V
- Number of Inputs :
- 293
- Speed :
- 166MHz
- Supply Voltage-Max (Vsup) :
- 1.26V
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Factory Lead Time :
- 12 Weeks
- Series :
- SmartFusion®2
- Number of I/O :
- 293
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- M2S150-1FCS536
536 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 293 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 536-LFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 150K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 293 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 536 terminations in total.In order for this SoC chip to work properly, you can have 293 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 293 inputs.In logic system on chips, there are 146124 logic cells.As for its flash size, it is 512KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150-1FCS536 System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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