M2S150-1FC1152I
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- Mfr.Part #
- M2S150-1FC1152I
- Manufacturer
- Microchip Technology
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 23,138
- In Stock ：
- 23,138
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Width :
- 35mm
- Supply Voltage :
- 1.2V
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage-Max (Vsup) :
- 1.26V
- Length :
- 35mm
- Power Supplies :
- 1.2V
- Supply Voltage-Min (Vsup) :
- 1.14V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Reach Compliance Code :
- not_compliant
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Height Seated (Max) :
- 2.9mm
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Architecture :
- MCU, FPGA
- Peripherals :
- DDR, PCIe, SERDES
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Base Part Number :
- M2S150
- Core Processor :
- ARM® Cortex®-M3
- Factory Lead Time :
- 12 Weeks
- RAM Size :
- 64KB
- Core Architecture :
- ARM
- JESD-609 Code :
- e0
- Package / Case :
- 1152-BBGA, FCBGA
- Terminal Form :
- Ball
- Number of Logic Cells :
- 146124
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Frequency :
- 166MHz
- Number of Outputs :
- 574
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2009
- HTS Code :
- 8542.39.00.01
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Terminal Pitch :
- 1mm
- Number of I/O :
- 574
- Series :
- SmartFusion®2
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Primary Attributes :
- FPGA - 150K Logic Modules
- Number of Inputs :
- 574
- Flash Size :
- 512kB
- JESD-30 Code :
- S-PBGA-B1152
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Datasheets
- M2S150-1FC1152I
-40°C~100°C TJ M2S150 System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 574 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.Power supply should be at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Using this SoC chip, you have the option of having 574 outputs.There is 1.2V power supply required for system on chip.There are 574 inputs available on the SoC chip.146124 logic cells are present in logic system on chips.The flash is set to 512KB.By searching M2S150, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150-1FC1152I System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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