LPC18S30FET256E

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Mfr.Part #
LPC18S30FET256E
Manufacturer
NXP Semiconductors
Package / Case
256-LBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 256LBGA
Stock
13,116
In Stock :
13,116

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Published :
2010
Speed :
180MHz
Oscillator Type :
Internal
Data Converter :
A/D 8x10b; D/A 1x10b
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
RoHS Status :
ROHS3 Compliant
Core Processor :
ARM® Cortex®-M3
Packaging :
Tray
Core Size :
32-Bit
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM Size :
200K x 8
Package / Case :
256-LBGA
Series :
LPC18xx
Program Memory Type :
ROMless
Factory Lead Time :
12 Weeks
Operating Temperature :
-40°C~85°C TA
Mounting Type :
Surface Mount
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Pin Count :
256
Number of I/O :
164
Datasheets
LPC18S30FET256E
Introducing Microcontrollers NXP Semiconductors LPC18S30FET256E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, LPC18S30FET256E pinout, LPC18S30FET256E datasheet PDF, LPC18S30FET256E amp .Beyond Microcontrollers NXP Semiconductors LPC18S30FET256E ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC18S30FET256E


Microcontrollers NXP Semiconductors LPC18S30FET256E Overview

The Microcontrollers NXP Semiconductors LPC18S30FET256E is a cutting-edge microcontroller unit (MCU) that is designed without on-board ROM, offering flexibility and customization for various advanced applications. Manufactured by NXP Semiconductors, a leader in the semiconductor industry, this MCU operates on a 32-bit architecture and is packaged in a 256-ball low-profile BGA (LBGA) package. This configuration provides robust performance and reliability for applications demanding high-speed operation and minimal footprint. Its ROM-less feature allows developers to use external memory for code and data, enabling more dynamic and scalable system designs.

LPC18S30FET256E Features

The LPC18S30FET256E MCU features a powerful ARM Cortex-M3 processor, which delivers exceptional processing capabilities and efficiency. This unit supports various serial communication interfaces, including USB, CAN, and Ethernet, facilitating versatile connectivity options. Its high clock speed enhances performance in complex processing tasks, making it ideal for embedded control applications. Additionally, the absence of built-in ROM provides developers with the flexibility to choose external storage based on the specific requirements of their application, further enhancing the device's adaptability and scalability.

LPC18S30FET256E Applications

  • Industrial Automation: In industrial environments, the LPC18S30FET256E can be utilized for controlling machinery and processes due to its robust processing capabilities and multiple I/O interfaces.
  • Medical Devices: Its high reliability and adaptability make it suitable for medical applications such as monitoring systems and portable diagnostics, where precision and operational dependability are crucial.
  • Automotive: This MCU is well-suited for automotive applications, including in-vehicle networking and sensor integration, thanks to its capacity to handle complex algorithms and data streams.
  • Consumer Electronics: The LPC18S30FET256E is perfect for smart home devices and entertainment systems, where its communication interfaces and high-speed processing power can enhance user interaction and functionality.
  • Communication Systems: It can also be applied in communication equipment like routers and switches, supporting high data throughput and connectivity features necessary for modern networking demands.
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