LPC1850FET180,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Form :

Ball

PWM Channels :

yes

Height Seated (Max) :

1.2mm

Length :

12mm

Program Memory Type :

ROMless

Published :

2010

Data Converter :

A/D 8x10b; D/A 1x10b

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

RAM Size :

200K x 8

Supply Voltage-Min (Vsup) :

2.2V

CPU Family :

CORTEX-M3

Mounting Type :

Surface Mount

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

ROM Programmability :

Flash

Number of I/O :

118

Width :

12mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

ROM (words) :

65536

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Source Url Status Check Date :

2013-06-14 00:00:00

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

12 Weeks

Supply Voltage :

3.3V

DMA Channels :

yes

Terminal Pitch :

0.8mm

Pin Count :

180

Oscillator Type :

Internal

Address Bus Width :

24

External Data Bus Width :

32

Core Size :

32-Bit

Has ADC :

yes

JESD-609 Code :

e1

RoHS Status :

ROHS3 Compliant

JESD-30 Code :

S-PBGA-B180

Core Processor :

ARM® Cortex®-M3

Clock Frequency :

25MHz

Series :

LPC18xx

DAC Channels :

yes

Number of Terminations :

180

Packaging :

Tray

Voltage - Supply (Vcc/Vdd) :

2.2V~3.6V

Base Part Number :

LPC1850

Power Supplies :

2.5/3.3V

Supply Voltage-Max (Vsup) :

3.6V

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Terminal Position :

BOTTOM

Bit Size :

32

Speed :

180MHz

Qualification Status :

Not Qualified

Peripherals :

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

Package / Case :

180-TFBGA

Operating Temperature :

-40°C~85°C TA