LPC1850FET180,551

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Mfr.Part #
LPC1850FET180,551
Manufacturer
NXP Semiconductors
Package / Case
180-TFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 180TFBGA
Stock
2,407
In Stock :
2,407

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Length :
12mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM Size :
200K x 8
Factory Lead Time :
12 Weeks
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Program Memory Type :
ROMless
Mounting Type :
Surface Mount
Width :
12mm
Supply Voltage-Min (Vsup) :
2.2V
Terminal Pitch :
0.8mm
Connectivity :
CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Power Supplies :
2.5/3.3V
Speed :
180MHz
Oscillator Type :
Internal
Series :
LPC18xx
ROM (words) :
65536
Core Size :
32-Bit
Terminal Position :
BOTTOM
Terminal Form :
Ball
Pin Count :
180
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
Has ADC :
yes
DMA Channels :
yes
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Bit Size :
32
Package / Case :
180-TFBGA
Source Url Status Check Date :
2013-06-14 00:00:00
CPU Family :
CORTEX-M3
Surface Mount :
yes
Clock Frequency :
25MHz
Address Bus Width :
24
Packaging :
Tray
Published :
2010
Data Converter :
A/D 8x10b; D/A 1x10b
ROM Programmability :
Flash
JESD-30 Code :
S-PBGA-B180
Number of I/O :
118
Supply Voltage :
3.3V
Number of Terminations :
180
Height Seated (Max) :
1.2mm
RoHS Status :
ROHS3 Compliant
External Data Bus Width :
32
JESD-609 Code :
e1
Core Processor :
ARM® Cortex®-M3
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Qualification Status :
Not Qualified
DAC Channels :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
PWM Channels :
yes
Supply Voltage-Max (Vsup) :
3.6V
Base Part Number :
LPC1850
Operating Temperature :
-40°C~85°C TA
Peripherals :
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Datasheets
LPC1850FET180,551
Introducing Microcontrollers NXP Semiconductors LPC1850FET180,551 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:180-TFBGA, Number of Terminations:180, Base Part Number:LPC1850, Operating Temperature:-40°C~85°C TA, LPC1850FET180,551 pinout, LPC1850FET180,551 datasheet PDF, LPC1850FET180,551 amp .Beyond Microcontrollers NXP Semiconductors LPC1850FET180,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC1850FET180,551


Microcontrollers NXP Semiconductors LPC1850FET180,551 Overview

The LPC1850FET180,551 by NXP Semiconductors represents a state-of-the-art microcontroller (MCU) designed for high-performance applications that demand robust operation, flexibility, and a wide range of connectivity options. As a member of the highly regarded LPC family, this 32-bit MCU lacks on-chip ROM, providing designers the freedom to implement tailored firmware and software solutions. The LPC1850FET180,551 is packaged in a compact 180TFBGA package, optimizing it for space-sensitive applications while still offering the powerful features of the Cortex-M3 processor core. Ideal for complex embedded systems, this microcontroller ensures high-speed data processing and effective communication interfaces, crucial for modern industrial, automotive, and consumer electronics markets.

LPC1850FET180,551 Features

  • 32-bit ARM Cortex-M3 processor: Ensures efficient handling of complex algorithms and processes.
  • ROM-less configuration: Provides flexibility for custom software applications, allowing memory expansion via external sources.
  • Advanced connectivity: Includes interfaces such as USB, CAN, Ethernet, and serial I/O for comprehensive system communications.
  • 180-TFBGA packaging: Offers a balance between physical compactness and ample pin access for peripheral functions.
  • Enhanced power management: Supports various power modes to minimize power consumption during idle or active states.

LPC1850FET180,551 Applications

  • Industrial Automation: Facilitates precise control in machinery and process management systems through its robust processing capabilities and connectivity options.
  • Automotive Electronics: Utilized in vehicle control systems to manage engine functions, in-car entertainment, and safety features, ensuring high reliability and performance.
  • Consumer Electronics: Ideal for complex multimedia applications and smart home devices, providing efficient processing for user interfaces and connectivity solutions.
  • Communication Infrastructure: Supports the development of network equipment and communication gateways, bolstering the backbone of modern communication systems.
  • Medical Devices: Used in medical diagnostic equipment and patient monitoring systems where precision and reliability are paramount.
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