LPC1810FET100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Package / Case :

100-TFBGA

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

JESD-609 Code :

e1

Voltage - Supply (Vcc/Vdd) :

2V~3.6V

Power Supplies :

2.5/3.3V

Terminal Form :

Ball

Data Converter :

A/D 12x10b; D/A 1x10b

Address Bus Width :

24

Operating Temperature :

-40°C~85°C

Factory Lead Time :

12 Weeks

Mounting Type :

Surface Mount

Length :

9mm

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

CPU Family :

CORTEX-M3

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Width :

9mm

Has ADC :

yes

JESD-30 Code :

S-PBGA-B100

DAC Channels :

yes

Base Part Number :

LPC1810

Qualification Status :

Not Qualified

External Data Bus Width :

32

ROM (words) :

65536

Supply Voltage-Min (Vsup) :

2.2V

Source Url Status Check Date :

2013-06-14 00:00:00

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Packaging :

Tray

Number of I/O :

64

RoHS Status :

ROHS3 Compliant

Speed :

150MHz

Number of Terminations :

100

Bit Size :

32

Supply Voltage-Max (Vsup) :

3.6V

Surface Mount :

yes

PWM Channels :

No

Clock Frequency :

25MHz

Pin Count :

100

Core Processor :

ARM® Cortex®-M3

Series :

LPC18xx

Terminal Position :

BOTTOM

Core Size :

32-Bit

Oscillator Type :

Internal

DMA Channels :

yes

Program Memory Type :

ROMless

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

ROM Programmability :

Flash

Height Seated (Max) :

1.2mm

RAM Size :

136K x 8

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Pitch :

0.8mm

Published :

2010

Supply Voltage :

3.3V