LPC1768FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Published :

2010

Operating Temperature :

-40°C~85°C TA

Program Memory Type :

Flash

Core Size :

32-Bit

CPU Family :

ARM7

HTS Code :

8542.31.00.01

PWM Channels :

yes

Number of I/O :

70

Height Seated (Max) :

1.6mm

Supply Voltage-Min (Vsup) :

2.4V

Surface Mount :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Core Processor :

ARM® Cortex®-M3

Data Converter :

A/D 8x12b; D/A 1x10b

ROM (words) :

524288

Bit Size :

32

Pin Count :

100

Package / Case :

100-LQFP

Power Supplies :

2.5/3.33/3.3V

Base Part Number :

LPC1768

Series :

LPC17xx

Number of Terminations :

100

Program Memory Size :

512KB 512K x 8

Terminal Form :

Gull wing

Mounting Type :

Surface Mount

Qualification Status :

Not Qualified

Width :

14mm

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Supply Voltage :

3.3V

Packaging :

Tray

RAM Size :

64K x 8

On Chip Program ROM Width :

8

Time@Peak Reflow Temperature-Max (s) :

30

Has ADC :

yes

RoHS Status :

ROHS3 Compliant

Speed :

100MHz

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Oscillator Type :

Internal

Terminal Pitch :

0.5mm

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

JESD-30 Code :

S-PQFP-G100

Clock Frequency :

25MHz

Factory Lead Time :

12 Weeks

ECCN Code :

EAR99

Length :

14mm

DAC Channels :

yes

Terminal Position :

QUAD

Voltage - Supply (Vcc/Vdd) :

2.4V~3.6V

Supply Voltage-Max (Vsup) :

3.6V

Peak Reflow Temperature (Cel) :

260

Additional Feature :

PART, ROHS INFO AND SHIPPING METHOD CONSIDERED FROM MFR WEBSITE

JESD-609 Code :

e3

DMA Channels :

yes

Terminal Finish :

Tin (Sn)