LPC1313FHN33,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

PWM Channels :

No

Terminal Finish :

MATTE TIN

Operating Temperature :

-40°C~85°C TA

Published :

2009

Bit Size :

32

Program Memory Size :

32KB 32K x 8

HTS Code :

8542.31.00.01

Power Supplies :

3.3V

Clock Frequency :

25MHz

Length :

7mm

JESD-30 Code :

S-PQCC-N33

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

RAM Size :

8K x 8

ECCN Code :

EAR99

Terminal Pitch :

0.65mm

Terminal Form :

NO LEAD

Qualification Status :

Not Qualified

Terminal Position :

QUAD

Supply Voltage :

3.3V

Oscillator Type :

Internal

Number of I/O :

28

DAC Channels :

No

Packaging :

Tray

Height Seated (Max) :

1mm

Width :

7mm

Voltage - Supply (Vcc/Vdd) :

2V~3.6V

Factory Lead Time :

12 Weeks

Program Memory Type :

Flash

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

ROM (words) :

32768

Speed :

72MHz

Package / Case :

32-VQFN Exposed Pad

CPU Family :

ARM7

Series :

LPC13xx

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Number of Terminations :

33

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Peak Reflow Temperature (Cel) :

260

Core Size :

32-Bit

Peripherals :

Brown-out Detect/Reset, POR, WDT

JESD-609 Code :

e3

Pin Count :

32

Has ADC :

yes

DMA Channels :

No

Core Processor :

ARM® Cortex®-M3

RoHS Status :

ROHS3 Compliant

Base Part Number :

LPC1313

Supply Voltage-Max (Vsup) :

3.6V

Data Converter :

A/D 8x10b

On Chip Program ROM Width :

8

Supply Voltage-Min (Vsup) :

2V