LFE3-70E-8FN1156I

Share

Or copy the link below:

Mfr.Part #
LFE3-70E-8FN1156I
Manufacturer
Lattice Semiconductor
Package / Case
1156-BBGA
Datasheet
Download
Description
IC FPGA 490 I/O 1156FBGA
Stock
40,159
In Stock :
40,159

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Base Part Number :
LFE3-70
Memory Size :
570.6kB
Terminal Form :
Ball
RAM Size :
552.5kB
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
35mm
Number of Outputs :
490
Mount :
Surface Mount
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code :
e1
Length :
35mm
Published :
2010
Height Seated (Max) :
2.6mm
RoHS Status :
RoHS Compliant
Number of LABs/CLBs :
8375
Number of I/O :
490
Qualification Status :
Not Qualified
Operating Supply Voltage :
1.2V
Package / Case :
1156-BBGA
Clock Frequency :
500MHz
Total RAM Bits :
4526080
Voltage - Supply :
1.14V~1.26V
Number of Logic Elements/Cells :
67000
Operating Temperature :
-40°C~100°C TJ
Terminal Position :
BOTTOM
Number of Pins :
1156
Series :
ECP3
Packaging :
Tray
Supply Voltage :
1.2V
ECCN Code :
EAR99
Datasheets
LFE3-70E-8FN1156I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-70E-8FN1156I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFE3-70, Mounting Type:Surface Mount, Package / Case:1156-BBGA, Operating Temperature:-40°C~100°C TJ, Number of Pins:1156, LFE3-70E-8FN1156I pinout, LFE3-70E-8FN1156I datasheet PDF, LFE3-70E-8FN1156I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-70E-8FN1156I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-70E-8FN1156I


FPGAs Lattice Semiconductor LFE3-70E-8FN1156I Overview

The FPGAs Lattice Semiconductor LFE3-70E-8FN1156I represents a high-performance FPGA designed to meet the rigorous demands of modern digital applications. This IC from Lattice Semiconductor integrates robust features within a 1156-pin FBGA package, making it an ideal solution for designers looking to enhance system efficiency and reliability. The chip is tailored for environments requiring high I/O interfacing and substantial logic capacity, thus supporting complex digital computations and signal processing tasks effectively. With its versatile functionality, the LFE3-70E-8FN1156I is adept at handling multiple roles across various industries, paving the way for innovation and advanced system designs.

LFE3-70E-8FN1156I Features

This FPGA boasts an impressive array of features including a high I/O count of 490, which provides ample flexibility for system expansion and integration. The chip's enhanced performance metrics are suitable for demanding applications, supported by its efficient heat dissipation and reliability in extended operational conditions. Furthermore, its compact 1156FBGA packaging ensures a minimal footprint on system boards, allowing for more efficient use of space in dense electronic assemblies.

LFE3-70E-8FN1156I Applications

  • Telecommunications: The LFE3-70E-8FN1156I can be used to manage data flow and signal processing within network infrastructure, enhancing bandwidth capabilities and reducing latency.
  • Automotive Systems: Integrated into driver assistance systems, this FPGA processes multiple inputs from sensors rapidly, contributing to safer driving technologies.
  • Industrial Automation: It excels in controlling machinery and industrial robots, providing the necessary computing power to execute complex control algorithms and real-time processing.
  • Consumer Electronics: Used in smart home devices, the FPGA facilitates responsive and adaptable functionality, optimizing user experience and device interoperability.
  • Medical Devices: Essential for medical imaging systems, this FPGA processes high volumes of data efficiently, ensuring real-time imaging and diagnostics.
This HTML content leverages the product’s key specifications to create an engaging overview and detailed applications list, tailored to attract B2B customers by highlighting the FPGA's versatility and potential for integration into various high-demand applications.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

RFQ
BOM