LFE3-150EA-6LFN1156C
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- Mfr.Part #
- LFE3-150EA-6LFN1156C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 1156-BBGA
- Datasheet
- Download
- Description
- IC FPGA 586 I/O 1156FBGA
- Stock
- 44,740
- In Stock ：
- 44,740
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 149000
- Number of Pins :
- 1156
- Total RAM Bits :
- 7014400
- HTS Code :
- 8542.39.00.01
- Base Part Number :
- LFE3-150
- Voltage - Supply :
- 1.14V~1.26V
- Number of I/O :
- 586
- Combinatorial Delay of a CLB-Max :
- 0.379 ns
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 375MHz
- Package / Case :
- 1156-BBGA
- Series :
- ECP3
- Number of LABs/CLBs :
- 18625
- Reach Compliance Code :
- not_compliant
- Packaging :
- Tray
- Power Supplies :
- 1.2V
- JESD-609 Code :
- e1
- Number of Outputs :
- 586
- Supply Voltage :
- 1.2V
- Qualification Status :
- Not Qualified
- Width :
- 35mm
- RAM Size :
- 856.3kB
- Lead Free :
- Lead Free
- Terminal Position :
- BOTTOM
- Height Seated (Max) :
- 2.6mm
- Length :
- 35mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 8 Weeks
- Mount :
- Surface Mount
- Published :
- 2012
- ECCN Code :
- EAR99
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- 250
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- LFE3-150EA-6LFN1156C
FPGAs Lattice Semiconductor LFE3-150EA-6LFN1156C Overview
Introducing the robust and versatile FPGAs Lattice Semiconductor LFE3-150EA-6LFN1156C, a high-performance Field Programmable Gate Array designed by Lattice Semiconductor to meet the demanding needs of modern technology sectors. This FPGA is ideal for developers looking to push the boundaries of connectivity and processing power. Encased in a 1156FBGA package, it offers a substantial array of 586 I/O options, making it a flexible solution for a myriad of applications. Its capacity to handle complex digital computations and signal processing tasks efficiently makes it a top choice for innovators and engineers aiming to develop advanced systems.
LFE3-150EA-6LFN1156C Features
This FPGA model comes packed with features designed for high scalability and performance in embedded systems. Key features include a high I/O count, which facilitates extensive peripheral connectivity and a large 1156 pin ball grid array (BGA) package that ensures robust physical connectivity and heat dissipation. The device supports a wide range of design implementations, thanks to its flexible programming capabilities and efficient power management, making it an excellent choice for critical applications.
LFE3-150EA-6LFN1156C Applications
- Telecommunications Equipment: Utilized for managing data traffic and signal processing within network hubs, routers, and switches to ensure efficient and reliable communication.
- Consumer Electronics: Acts as the core processing unit in high-performance consumer devices such as gaming consoles and high-definition television sets, where extensive I/O capabilities and high-speed processing are crucial.
- Automotive Systems: Implemented in advanced driver-assistance systems (ADAS) to process real-time sensor data and support critical vehicle functions, enhancing safety and performance on the road.
- Industrial Automation: Powers complex industrial control systems, providing the necessary speed and adaptability for real-time process control and machine-to-machine communication.
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