LFE3-150EA-7FN1156C

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Mfr.Part #
LFE3-150EA-7FN1156C
Manufacturer
Lattice Semiconductor
Package / Case
1156-BBGA
Datasheet
Download
Description
IC FPGA 586 I/O 1156FBGA
Stock
2
In Stock :
2

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
7014400
Width :
35mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Lead Free :
Lead Free
RAM Size :
856.3kB
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
250
Number of LABs/CLBs :
18625
Length :
35mm
Number of Pins :
1156
JESD-609 Code :
e1
Combinatorial Delay of a CLB-Max :
0.335 ns
Number of I/O :
586
Packaging :
Tray
Number of Outputs :
586
Base Part Number :
LFE3-150
Clock Frequency :
420MHz
Factory Lead Time :
8 Weeks
Published :
2012
Height Seated (Max) :
2.6mm
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
149000
HTS Code :
8542.39.00.01
Package / Case :
1156-BBGA
Reach Compliance Code :
not_compliant
ECCN Code :
EAR99
Qualification Status :
Not Qualified
Supply Voltage :
1.2V
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Series :
ECP3
Terminal Position :
BOTTOM
Mount :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
1.2V
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-150EA-7FN1156C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1156, Base Part Number:LFE3-150, Operating Temperature:0°C~85°C TJ, Package / Case:1156-BBGA, Mounting Type:Surface Mount, LFE3-150EA-7FN1156C pinout, LFE3-150EA-7FN1156C datasheet PDF, LFE3-150EA-7FN1156C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-150EA-7FN1156C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-150EA-7FN1156C


FPGAs Lattice Semiconductor LFE3-150EA-7FN1156C Overview

Introducing the FPGAs Lattice Semiconductor LFE3-150EA-7FN1156C, a high-performance FPGA designed for versatile applications requiring a flexible integration solution with a high I/O count. Manufactured by Lattice Semiconductor, a leader in low power programmable logic, this FPGA features a 1156-pin FBGA package that provides robust interfacing capabilities, suitable for demanding environments. This product excels in delivering high-speed performance while maintaining low power consumption, making it an ideal choice for developers looking to optimize their systems for efficiency and reliability. The LFE3-150EA-7FN1156C is built to meet the complex processing needs of modern digital applications, providing a reliable foundation for innovation and development.

LFE3-150EA-7FN1156C Features

The LFE3-150EA-7FN1156C FPGA boasts 586 I/O pins which provide substantial flexibility in system design, allowing for a wide range of peripherals and functions to be added. Its architecture is optimized for efficient power management, which significantly reduces the thermal footprint in tightly packed system configurations. Additionally, the FPGA's robust packaging ensures reliability and durability even in the most challenging conditions, promoting long-term operational stability.

LFE3-150EA-7FN1156C Applications

  • Telecommunications Infrastructure: Utilized in routers and switches, the FPGA enhances signal integrity and processing speed, improving network efficiency and reliability.
  • Industrial Automation: Empowers complex machinery controls and real-time processing tasks, enabling more responsive and adaptable manufacturing systems.
  • Automotive Applications: Supports advanced driver-assistance systems (ADAS) by accelerating image processing and decision algorithms, enhancing vehicle safety and performance.
  • Consumer Electronics: Integrated into devices such as smart TVs and gaming consoles, where its capacity for handling multiple I/O streams boosts multimedia processing capabilities.
  • Medical Devices: Critical in the design of diagnostic and imaging equipment, where its high-speed processing capabilities enable faster, more accurate patient care solutions.
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