LFE3-70E-6FN672I

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Mfr.Part #
LFE3-70E-6FN672I
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 380 I/O 672FPBGA
Stock
5,936
In Stock :
5,936

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Pin Count :
672
Number of Outputs :
380
Terminal Pitch :
1mm
Series :
ECP3
Terminal Position :
BOTTOM
Height Seated (Max) :
2.6mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length :
27mm
Mount :
Surface Mount
Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.14V~1.26V
HTS Code :
8542.39.00.01
JESD-609 Code :
e1
Number of Logic Elements/Cells :
67000
Operating Temperature :
-40°C~100°C TJ
RAM Size :
552.5kB
Number of Terminations :
672
Width :
27mm
Total RAM Bits :
4526080
Packaging :
Tray
ECCN Code :
EAR99
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Published :
2010
Base Part Number :
LFE3-70
Number of LABs/CLBs :
8375
Terminal Form :
Ball
Memory Size :
570.6kB
Clock Frequency :
375MHz
Package / Case :
672-BBGA
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Number of I/O :
380
Number of Pins :
672
Datasheets
LFE3-70E-6FN672I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-70E-6FN672I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Terminations:672, Mounting Type:Surface Mount, Base Part Number:LFE3-70, Package / Case:672-BBGA, Number of Pins:672, LFE3-70E-6FN672I pinout, LFE3-70E-6FN672I datasheet PDF, LFE3-70E-6FN672I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-70E-6FN672I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-70E-6FN672I


FPGAs Lattice Semiconductor LFE3-70E-6FN672I Overview

Introducing the LFE3-70E-6FN672I from Lattice Semiconductor, a cutting-edge Field Programmable Gate Array (FPGA) designed for optimal performance in complex digital circuits. This FPGA stands out in the market for its versatile 672-pin Fine Pitch Ball Grid Array (FPBGA) package, allowing for a high density of I/O interfaces with up to 380 accessible I/O pins. Ideal for designers aiming to accelerate product development cycles, the LFE3-70E-6FN672I provides a flexible, efficient platform suitable for a myriad of demanding applications. Its robust design is tailored to meet the intricate requirements of high-speed digital processing, making it a premier choice for businesses looking to enhance their technology infrastructure.

LFE3-70E-6FN672I Features

The LFE3-70E-6FN672I FPGA offers numerous features that cater to the needs of advanced digital systems. Its substantial I/O capability is complemented by a high-speed SerDes, making it perfect for data-intensive applications. The chip supports a variety of logic density options, allowing customization to fit specific project requirements. Additionally, the FPGA includes power-saving features that reduce overall energy consumption without compromising performance, ensuring both cost-efficiency and eco-friendliness in deployment.

LFE3-70E-6FN672I Applications

  • Telecommunications: In telecom infrastructure, this FPGA can manage signal processing tasks, improving bandwidth and reducing latency in systems such as 4G/5G base stations.
  • Automotive Systems: Utilized in driver assistance systems, the LFE3-70E-6FN672I enhances sensor data processing capabilities, contributing to safer and smarter vehicle controls.
  • Industrial Automation: This FPGA excels in managing control systems and real-time data processing for manufacturing robots and assembly lines, enhancing efficiency and reliability.
  • Consumer Electronics: Applied in devices like high-definition televisions and gaming consoles, it supports complex graphics processing and user interface enhancements.
  • Medical Devices: Ideal for handling the computations required in medical imaging equipment, thereby increasing the precision and speed of diagnostics.
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