LFE3-17EA-8LFTN256I

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Mfr.Part #
LFE3-17EA-8LFTN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 133 I/O 256FTBGA
Stock
34,259
In Stock :
34,259

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
260
Published :
2012
RAM Size :
87.5kB
Package / Case :
256-BGA
Number of LABs/CLBs :
2125
Reach Compliance Code :
not_compliant
Terminal Pitch :
1mm
Number of I/O :
133
Combinatorial Delay of a CLB-Max :
0.281 ns
JESD-609 Code :
e1
Number of Inputs :
133
Packaging :
Tray
Terminal Position :
BOTTOM
Base Part Number :
LFE3-17
Factory Lead Time :
8 Weeks
Qualification Status :
Not Qualified
Number of Outputs :
133
Clock Frequency :
500MHz
Height Seated (Max) :
1.55mm
Width :
17mm
Voltage - Supply :
1.14V~1.26V
Series :
ECP3
Number of Terminations :
256
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
716800
HTS Code :
8542.39.00.01
ECCN Code :
EAR99
Lead Free :
Lead Free
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.2V
Terminal Form :
Ball
Pin Count :
256
Mount :
Surface Mount
Mounting Type :
Surface Mount
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Power Supplies :
1.2V
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
17000
JESD-30 Code :
S-PBGA-B256
Operating Temperature :
-40°C~100°C TJ
Length :
17mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
yes
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-8LFTN256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BGA, Base Part Number:LFE3-17, Number of Terminations:256, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, LFE3-17EA-8LFTN256I pinout, LFE3-17EA-8LFTN256I datasheet PDF, LFE3-17EA-8LFTN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-8LFTN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-17EA-8LFTN256I


FPGAs Lattice Semiconductor LFE3-17EA-8LFTN256I Overview

The FPGAs Lattice Semiconductor LFE3-17EA-8LFTN256I represents a cutting-edge solution in the realm of programmable logic devices. Designed by Lattice Semiconductor, a leader in the field, this IC FPGA (Field Programmable Gate Array) is crafted for high-performance applications requiring flexible I/O configurations and substantial logic density. With its compact 256FTBGA (Fine-Pitch Ball Grid Array) packaging, this FPGA offers a robust platform for developers looking to integrate complex logic systems into a small footprint. The key feature of this product is its versatility, supported by 133 I/O pins, making it ideal for a multitude of industrial, consumer, and automotive applications where space and power efficiency are paramount.

LFE3-17EA-8LFTN256I Features

This FPGA from Lattice Semiconductor includes several features that make it highly suitable for demanding applications:

  • High I/O Count: Boasting 133 input/output pins, it allows for extensive interfacing with other components.
  • Compact Size: The 256FTBGA packaging is designed for minimal space occupation, perfect for densely packed electronic assemblies.
  • Energy Efficiency: Optimized for low power consumption, it helps in developing energy-efficient products.
  • High Performance: Engineered to deliver high-speed performance which is essential for data-intensive functions.

LFE3-17EA-8LFTN256I Applications

  • Consumer Electronics: Integrated in devices like smart watches and gaming consoles, where its ability to handle multiple inputs and outputs at high speeds enhances user interfaces and gaming experiences.
  • Automotive Applications: Used in advanced driver-assistance systems (ADAS) to process multiple sensor data inputs, improving vehicle safety and performance.
  • Industrial Automation: Powers complex automation systems, facilitating improved control and efficiency in manufacturing processes.
  • Telecommunications: Essential in telecom infrastructure, supporting rapid data processing and connectivity enhancements for better network performance.
  • Medical Devices: Applied in medical imaging systems, enabling quick processing of complex imaging data to assist in faster and more accurate diagnostics.
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