LFE3-17EA-8LFTN256C

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Mfr.Part #
LFE3-17EA-8LFTN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 133 I/O 256FTBGA
Stock
11,655
In Stock :
11,655

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Position :
BOTTOM
Base Part Number :
LFE3-17
Peak Reflow Temperature (Cel) :
260
Number of Logic Elements/Cells :
17000
Series :
ECP3
Number of Terminations :
256
Combinatorial Delay of a CLB-Max :
0.281 ns
Pin Count :
256
HTS Code :
8542.39.00.01
RoHS Status :
ROHS3 Compliant
Mount :
Surface Mount
JESD-609 Code :
e1
Published :
2012
Length :
17mm
Number of Inputs :
133
Qualification Status :
Not Qualified
Operating Temperature :
0°C~85°C TJ
JESD-30 Code :
S-PBGA-B256
Supply Voltage :
1.2V
Mounting Type :
Surface Mount
Packaging :
Tray
RAM Size :
87.5kB
Time@Peak Reflow Temperature-Max (s) :
30
Package / Case :
256-BGA
Number of LABs/CLBs :
2125
Number of Outputs :
133
Width :
17mm
Height Seated (Max) :
1.55mm
Power Supplies :
1.2V
Reach Compliance Code :
not_compliant
Lead Free :
Lead Free
Pbfree Code :
yes
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
8 Weeks
Number of I/O :
133
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
ECCN Code :
EAR99
Voltage - Supply :
1.14V~1.26V
Total RAM Bits :
716800
Clock Frequency :
500MHz
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-8LFTN256C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFE3-17, Number of Terminations:256, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:256-BGA, LFE3-17EA-8LFTN256C pinout, LFE3-17EA-8LFTN256C datasheet PDF, LFE3-17EA-8LFTN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-8LFTN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-17EA-8LFTN256C


FPGAs Lattice Semiconductor LFE3-17EA-8LFTN256C Overview

The LFE3-17EA-8LFTN256C from Lattice Semiconductor represents a sophisticated balance of performance and efficiency in the realm of field programmable gate arrays (FPGAs). Designed to deliver powerful flexibility, this device empowers engineers with a high-density, programmable architecture ideal for a diverse range of applications. The FPGA is housed in a compact 256FTBGA package, featuring 133 I/Os that provide substantial connectivity options for various design requirements. This specific model, tailored for optimizing logic density and I/O performance, is a prime choice for developers looking to harness FPGA technology for complex, next-generation digital circuits.

LFE3-17EA-8LFTN256C Features

The LFE3-17EA-8LFTN256C FPGA boasts a series of robust features that facilitate versatile applications across multiple domains. Key attributes include a high logic density, making it suitable for sophisticated digital processing tasks. Its 133 input/output pins enable broad interfacing capabilities, while its support for various standard and proprietary protocols ensures it can be seamlessly integrated into existing technology frameworks. The device is also designed for reduced power consumption, enhancing its suitability for power-sensitive applications.

LFE3-17EA-8LFTN256C Applications

  • Telecommunications: Used in communication infrastructure, this FPGA can handle complex signal processing tasks, thus improving data flow and network reliability.
  • Consumer Electronics: Integral to the development of consumer electronics, such as high-performance gaming consoles and smart home devices, where flexible I/O and processing power are crucial.
  • Industrial Automation: Facilitates the control and management systems in automated production lines, enhancing operational efficiency and reliability.
  • Automotive Technology: Employs advanced driver-assistance systems (ADAS) by managing multiple sensor inputs and real-time processing requirements.
  • Medical Devices: Critical in medical imaging and diagnostic equipment, offering the necessary speed and adaptability for complex, real-time data processing.
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