LFE3-17EA-8FTN256C

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Mfr.Part #
LFE3-17EA-8FTN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 133 I/O 256FTBGA
Stock
7,475
In Stock :
7,475

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Lead Free :
Lead Free
Pin Count :
256
Width :
17mm
Max Frequency :
3.1MHz
Combinatorial Delay of a CLB-Max :
0.281 ns
Memory Size :
92kB
Number of Logic Elements/Cells :
17000
Operating Temperature :
0°C~85°C TJ
Package / Case :
256-BGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Blocks (LABs) :
1500
Mount :
Surface Mount
Packaging :
Tray
Total RAM Bits :
716800
Height Seated (Max) :
1.55mm
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Terminal Form :
Ball
Number of LABs/CLBs :
2125
Number of Terminations :
256
Voltage - Supply :
1.14V~1.26V
Number of I/O :
133
Supply Voltage :
1.2V
Peak Reflow Temperature (Cel) :
260
Series :
ECP3
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Qualification Status :
Not Qualified
Pbfree Code :
yes
Reach Compliance Code :
not_compliant
Number of Pins :
256
ECCN Code :
EAR99
RAM Size :
27.6kB
Length :
17mm
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e1
Operating Supply Voltage :
1.2V
Operating Supply Current :
18mA
Number of Outputs :
133
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Base Part Number :
LFE3-17
Published :
2013
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Factory Lead Time :
8 Weeks
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-8FTN256C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:256-BGA, Mounting Type:Surface Mount, Number of Terminations:256, Number of Pins:256, Base Part Number:LFE3-17, LFE3-17EA-8FTN256C pinout, LFE3-17EA-8FTN256C datasheet PDF, LFE3-17EA-8FTN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-8FTN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-17EA-8FTN256C


FPGAs Lattice Semiconductor LFE3-17EA-8FTN256C Overview

Introducing the FPGAs Lattice Semiconductor LFE3-17EA-8FTN256C, a highly versatile and powerful FPGA designed to meet the demanding requirements of modern digital applications. This product is a standout in the Lattice Semiconductor portfolio, featuring a flexible architecture that supports a wide range of functionalities. With its compact 256FTBGA package, it ensures a minimized footprint while maximizing performance, reliability, and scalability. Ideal for designers looking for a cost-effective yet powerful solution, the LFE3-17EA-8FTN256C offers excellent integration capabilities in various technological environments, making it an essential choice for high-performance applications.

LFE3-17EA-8FTN256C Features

The LFE3-17EA-8FTN256C FPGA boasts an impressive array of features that cater to a broad spectrum of technology needs. It includes 133 user I/Os, allowing for extensive interfacing with other peripherals and systems. The device is housed in a 256-ball fine-pitch BGA (FTBGA) package, which provides robust physical integration while supporting dense circuit designs. This IC FPGA is specifically engineered for optimal performance and low power consumption, making it suitable for both high-speed industrial applications and power-sensitive portable devices.

LFE3-17EA-8FTN256C Applications

  • Consumer Electronics: Utilized in devices such as digital cameras, gaming consoles, and smart TVs, where its ability to rapidly process inputs and outputs enhances user experience and device functionality.
  • Automotive Systems: Integral for advanced driver-assistance systems (ADAS), infotainment, and vehicle-to-everything (V2X) communications, providing the necessary processing power and connectivity.
  • Industrial Automation: Applied in machine control systems, robotics, and real-time data processing equipment, where its speed and reliability facilitate increased productivity and safety.
  • Communications Infrastructure: Supports high-speed network systems, including routers, switches, and base stations, by managing multiple data streams efficiently and reliably.
  • Medical Devices: Critical in the operation of medical imaging systems such as MRI and ultrasound machines, where its processing capabilities enable faster, more accurate diagnostics.
This HTML formatted content highlights the product's features, potential applications, and provides an overview suitable for B2B marketing, especially focusing on bulk purchases by highlighting the device's adaptability and performance.
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