LFE3-17EA-7FTN256C

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Mfr.Part #
LFE3-17EA-7FTN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 133 I/O 256FTBGA
Stock
3,832
In Stock :
3,832

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
RAM Size :
87.5kB
Published :
2006
Pbfree Code :
yes
Max Frequency :
3.1MHz
Factory Lead Time :
8 Weeks
Height Seated (Max) :
1.55mm
Pin Count :
256
Base Part Number :
LFE3-17
Combinatorial Delay of a CLB-Max :
0.335 ns
Packaging :
Tray
Voltage - Supply :
1.14V~1.26V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Series :
ECP3
Terminal Form :
Ball
Number of LABs/CLBs :
2125
HTS Code :
8542.39.00.01
JESD-609 Code :
e1
Radiation Hardening :
No
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
17000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Operating Supply Voltage :
1.2V
Length :
17mm
Peak Reflow Temperature (Cel) :
260
Operating Supply Current :
18mA
Mounting Type :
Surface Mount
Package / Case :
256-BGA
Total RAM Bits :
716800
Lead Free :
Lead Free
Number of I/O :
133
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
ROHS3 Compliant
Number of Outputs :
133
Number of Terminations :
256
Terminal Position :
BOTTOM
ECCN Code :
EAR99
Width :
17mm
Memory Size :
92kB
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Supply Voltage :
1.2V
Number of Pins :
256
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-7FTN256C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFE3-17, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:256-BGA, Number of Terminations:256, Number of Pins:256, LFE3-17EA-7FTN256C pinout, LFE3-17EA-7FTN256C datasheet PDF, LFE3-17EA-7FTN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-7FTN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-17EA-7FTN256C


FPGAs Lattice Semiconductor LFE3-17EA-7FTN256C Overview

The LFE3-17EA-7FTN256C from Lattice Semiconductor represents a cutting-edge solution within the field of FPGAs (Field Programmable Gate Arrays). Engineered to deliver high performance coupled with efficient power management, this IC FPGA offers versatile I/O options contained within a compact 256FTBGA package. The product is designed to meet the rigorous demands of modern digital applications, making it an excellent choice for developers looking to leverage flexible hardware configurations with substantial logic and routing capabilities. Incorporating this FPGAs Lattice Semiconductor LFE3-17EA-7FTN256C into your designs ensures robustness and adaptability, paving the way for innovative applications across various industries.

LFE3-17EA-7FTN256C Features

This FPGA device stands out due to its comprehensive set of features, which includes 133 I/O pins that provide ample connectivity for a multitude of digital and analog inputs and outputs. The compact 256FTBGA package ensures that it can be integrated into systems where space is at a premium while still providing the functional density required for complex designs. The device also supports a range of logic densities, making it versatile enough to handle both straightforward and complex tasks effectively.

LFE3-17EA-7FTN256C Applications

  • Consumer Electronics: Employed in devices such as smartphones, tablets, and smart TVs to manage signal processing tasks efficiently.
  • Industrial Automation: Integrates into control systems for machinery, improving the efficiency and adaptability of manufacturing processes.
  • Automotive Systems: Utilized in car entertainment and navigation systems, enhancing the interface and user experience.
  • Telecommunications: Critical in the design of routers and switches, supporting the demands of high-speed data processing and communication.
  • Medical Devices: Applied in medical imaging systems, enabling complex digital processing required for high-resolution imaging technologies.
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