LFE3-17EA-6LFTN256C

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Mfr.Part #
LFE3-17EA-6LFTN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 133 I/O 256FTBGA
Stock
30,231
In Stock :
30,231

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Clock Frequency :
375MHz
Height Seated (Max) :
1.55mm
Mounting Type :
Surface Mount
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
256
ECCN Code :
EAR99
Number of Inputs :
133
Pbfree Code :
yes
Reach Compliance Code :
not_compliant
Number of Logic Elements/Cells :
17000
HTS Code :
8542.39.00.01
Length :
17mm
Power Supplies :
1.2V
Qualification Status :
Not Qualified
Total RAM Bits :
716800
Number of I/O :
133
Combinatorial Delay of a CLB-Max :
0.379 ns
Voltage - Supply :
1.14V~1.26V
Number of LABs/CLBs :
2125
Time@Peak Reflow Temperature-Max (s) :
30
Published :
2012
Operating Temperature :
0°C~85°C TJ
JESD-30 Code :
S-PBGA-B256
Series :
ECP3
Terminal Form :
Ball
Supply Voltage :
1.2V
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Peak Reflow Temperature (Cel) :
260
Base Part Number :
LFE3-17
RoHS Status :
ROHS3 Compliant
Width :
17mm
Terminal Pitch :
1mm
Terminal Position :
BOTTOM
Pin Count :
256
Factory Lead Time :
8 Weeks
Packaging :
Tray
Package / Case :
256-BGA
JESD-609 Code :
e1
Number of Outputs :
133
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-6LFTN256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:256, Operating Temperature:0°C~85°C TJ, Base Part Number:LFE3-17, Package / Case:256-BGA, LFE3-17EA-6LFTN256C pinout, LFE3-17EA-6LFTN256C datasheet PDF, LFE3-17EA-6LFTN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-17EA-6LFTN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-17EA-6LFTN256C


FPGAs Lattice Semiconductor LFE3-17EA-6LFTN256C Overview

The FPGAs Lattice Semiconductor LFE3-17EA-6LFTN256C represents a versatile, high-performance FPGA designed to meet the evolving needs of modern embedded and digital applications. This product by Lattice Semiconductor is crafted to deliver exceptional programmability along with a balance of low power consumption and ample logic density, making it ideal for a wide array of industry applications. Its compact 256FTBGA packaging ensures a minimal footprint on system boards, facilitating more efficient design layouts and improving thermal performance in densely packed electronics. The use of this specific FPGA can significantly enhance system reliability and performance, paving the way for innovative design and development in complex digital environments.

LFE3-17EA-6LFTN256C Features

This FPGA module integrates 133 I/O pins, offering ample flexibility for interfacing with other components in a system. The LFE3-17EA-6LFTN256C's high I/O count is critical for applications requiring numerous connections for sensors, actuators, and other peripherals. The 256FTBGA package contributes to a robust design that withstands rigorous industrial applications while supporting the dense integration of features needed for advanced processing and interfacing capabilities.

LFE3-17EA-6LFTN256C Applications

  • Industrial Automation: In automation systems, this FPGA can manage multiple control systems and sensor networks, enhancing the efficiency and scalability of industrial operations.
  • Automotive Technology: Utilized in vehicle systems for controlling functions such as collision detection sensors and engine management systems, ensuring high reliability and responsiveness under diverse conditions.
  • Consumer Electronics: Perfect for use in smart home devices, where its ability to handle multiple inputs and outputs can enhance device interconnectivity and functionality.
  • Telecommunications: Supports complex digital signal processing tasks in communication infrastructure, vital for the fast, reliable processing needed in modern telecom networks.
  • Medical Devices: Ideal for use in medical diagnostic equipment where precision and operational reliability are paramount, facilitating enhanced patient monitoring and diagnostics.
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