LFE3-150EA-9FN1156C

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Mfr.Part #
LFE3-150EA-9FN1156C
Manufacturer
Lattice Semiconductor
Package / Case
1156-BBGA
Datasheet
Download
Description
IC FPGA 586 I/O 1156FBGA
Stock
16,325
In Stock :
16,325

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Pins :
1156
HTS Code :
8542.39.00.01
Number of Logic Elements/Cells :
149000
Series :
ECP3
Number of Outputs :
586
Clock Frequency :
500MHz
Operating Temperature :
0°C~85°C TJ
Qualification Status :
Not Qualified
Length :
35mm
Mount :
Surface Mount
RAM Size :
856.3kB
Base Part Number :
LFE3-150
Combinatorial Delay of a CLB-Max :
0.252 ns
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Reach Compliance Code :
not_compliant
Terminal Pitch :
1mm
Terminal Position :
BOTTOM
Number of LABs/CLBs :
18625
Voltage - Supply :
1.14V~1.26V
Package / Case :
1156-BBGA
Width :
35mm
Mounting Type :
Surface Mount
Number of I/O :
586
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
2.6mm
RoHS Status :
ROHS3 Compliant
Total RAM Bits :
7014400
Lead Free :
Lead Free
Terminal Form :
Ball
Published :
2012
Supply Voltage :
1.2V
ECCN Code :
EAR99
Operating Supply Voltage :
1.2V
Packaging :
Tray
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-150EA-9FN1156C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1156, Operating Temperature:0°C~85°C TJ, Base Part Number:LFE3-150, Package / Case:1156-BBGA, Mounting Type:Surface Mount, LFE3-150EA-9FN1156C pinout, LFE3-150EA-9FN1156C datasheet PDF, LFE3-150EA-9FN1156C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE3-150EA-9FN1156C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE3-150EA-9FN1156C


FPGAs Lattice Semiconductor LFE3-150EA-9FN1156C Overview

The FPGAs Lattice Semiconductor LFE3-150EA-9FN1156C is an advanced field programmable gate array (FPGA) designed for high-speed, complex digital signal processing and system integration. This device from Lattice Semiconductor enables designers to achieve high levels of performance and flexibility in their applications. With its large array of 586 I/O pins housed in a compact 1156FBGA package, the LFE3-150EA-9FN1156C provides a versatile platform for creating scalable, customized digital logic circuits and interfaces. Ideal for rapid prototyping and production deployment, this FPGA is equipped to handle a multitude of high-performance computing tasks in a power-efficient manner.

LFE3-150EA-9FN1156C Features

This LFE3-150EA-9FN1156C FPGA boasts an array of features that make it a competitive choice for system designers. It supports a wide range of I/O standards, enabling compatibility with most modern digital interfaces. Furthermore, its high gate density allows for efficient utilization of space and power, enhancing overall system reliability and performance. The integration of advanced security features ensures safe data handling and protection against unauthorized access, making it a robust choice for sensitive applications.

LFE3-150EA-9FN1156C Applications

  • Telecommunications Equipment: This FPGA can be integrated into routers, switches, and other networking hardware to increase protocol flexibility and support high-speed data operations.
  • Automotive Electronics: Utilized in vehicle infotainment systems and advanced driver-assistance systems (ADAS) to perform real-time processing of complex inputs from multiple sensors.
  • Consumer Electronics: Ideal for high-performance, multi-function consumer products such as gaming consoles and smart TVs, where versatile digital processing is required.
  • Industrial Automation: Provides the processing power needed for control systems and robotic applications that require robust, real-time operations in varying environmental conditions.
  • Medical Devices: Enhances functionalities in medical imaging and diagnostic equipment, contributing to faster and more accurate patient care through improved data analysis capabilities.
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