LFE3-150EA-7LFN1156C
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- Mfr.Part #
- LFE3-150EA-7LFN1156C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 1156-BBGA
- Datasheet
- Download
- Description
- IC FPGA 586 I/O 1156FBGA
- Stock
- 21,063
- In Stock ：
- 21,063
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 2.6mm
- Number of Outputs :
- 586
- Clock Frequency :
- 420MHz
- Package / Case :
- 1156-BBGA
- Terminal Form :
- Ball
- ECCN Code :
- EAR99
- Number of LABs/CLBs :
- 18625
- Terminal Pitch :
- 1mm
- Reach Compliance Code :
- not_compliant
- Width :
- 35mm
- Number of Logic Elements/Cells :
- 149000
- Factory Lead Time :
- 8 Weeks
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.335 ns
- RAM Size :
- 856.3kB
- Number of Pins :
- 1156
- Operating Temperature :
- 0°C~85°C TJ
- Total RAM Bits :
- 7014400
- Lead Free :
- Lead Free
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Base Part Number :
- LFE3-150
- HTS Code :
- 8542.39.00.01
- Series :
- ECP3
- Power Supplies :
- 1.2V
- Published :
- 2012
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of I/O :
- 586
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Length :
- 35mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 1.2V
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 250
- Datasheets
- LFE3-150EA-7LFN1156C
FPGAs Lattice Semiconductor LFE3-150EA-7LFN1156C Overview
The LFE3-150EA-7LFN1156C from Lattice Semiconductor represents a pinnacle in the FPGA (Field Programmable Gate Array) market, tailored specifically for sophisticated digital signal processing and high-speed data handling tasks. As part of Lattice's renowned ECP3 series, this device offers a perfect balance of power efficiency and performance capabilities, making it an ideal solution for designers looking to optimize their system architecture. With its 1156-pin FBGA package, the FPGA allows for a dense and compact layout, facilitating integration into a wide range of industrial and commercial applications. Leveraging the 'FPGAs Lattice Semiconductor LFE3-150EA-7LFN1156C' in your designs ensures robust adaptability and enhanced functionality, meeting the evolving demands of modern technology landscapes.
LFE3-150EA-7LFN1156C Features
This FPGA model boasts an impressive array of features designed for high efficiency and flexibility across various applications:
- High I/O Count: With 586 programmable I/Os, it facilitates extensive interfacing with peripherals and other ICs.
- High-Speed SERDES Transceivers: Integrated transceivers support rapid data transmission, crucial for telecom and data communication systems.
- Low Power Consumption: Advanced power management techniques ensure the device operates efficiently, reducing overall energy costs.
- Flexible Logic Resources: A substantial array of logic elements enables complex digital circuit design, enhancing device versatility.
- Compact Form Factor: The 1156FBGA package is optimized for space-sensitive applications without compromising on performance.
LFE3-150EA-7LFN1156C Applications
- Telecommunications Equipment: This FPGA can be used to enhance signal integrity and speed in routers and switches, supporting the robust needs of modern telecom infrastructures.
- Automotive Driver Assistance Systems: Its high processing power and I/O flexibility make it suitable for integration into automotive safety and navigation systems, where real-time data processing is critical.
- Industrial Automation: The FPGA's ability to handle complex algorithms efficiently makes it ideal for PLCs and motor control units, improving operational efficiency and reliability.
- Consumer Electronics: Used in high-performance home entertainment systems, the FPGA improves video processing capabilities, ensuring higher quality and smoother playback.
- Medical Imaging Devices: Its advanced features support the demands of medical imaging technologies, facilitating faster and more accurate diagnostic capabilities.
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