HTSW-135-08-L-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Additional Feature :

E.L.P.

Mating Contact Pitch :

0.1 inch

Packaging :

Bulk

Contact Finish - Post :

Tin

PCB Contact Pattern :

RECTANGULAR

MIL Conformance :

No

Row Spacing - Mating :

0.100 (2.54mm)

Contact Finish - Mating :

Gold

Current Rating (Amps) :

Varies by WireGAuge

Termination :

Solder

Insulation Material :

Liquid Crystal Polymer (LCP)

IEC Conformance :

No

Fastening Type :

Push-Pull

Style :

Board to Board or Cable

Contact Length - Mating :

0.230 5.84mm

Contact Type :

Male Pin

Connector Type :

Header

Body Depth :

0.1 inch

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Contact Shape :

Square

Insulation Height :

0.100 2.54mm

Material Flammability Rating :

UL94 V-0

Pbfree Code :

yes

Number of Positions Loaded :

All

Shrouding :

Unshrouded

Pitch - Mating :

0.100 2.54mm

Mixed Contacts :

No

Contact Length - Post :

0.200 5.08mm

Radiation Hardening :

No

Number of Rows :

2

Gender :

Male

Reliability :

COMMERCIAL

Published :

2005

Number of Positions :

70

Body Breadth :

0.198 inch

Contact Material :

Phosphor Bronze

Mount :

Through Hole

Option :

GENERAL PURPOSE

Operating Temperature :

-55°C~125°C

Lead Pitch :

2.54mm

Series :

HTSW

Number of Conductors :

ONE

DIN Conformance :

No

JESD-609 Code :

e3

Moisture Sensitivity Level (MSL) :

Not Applicable

Insulation Color :

Natural

Filter Feature :

No

Number Of PCB Rows :

2

Mounting Type :

Through Hole

RoHS Status :

ROHS3 Compliant

Overall Contact Length :

0.530 13.46mm

Body Length or Diameter :

3.5 inch

Factory Lead Time :

3 Weeks

REACH SVHC :

No SVHC