HTSW-130-19-F-T

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

DIN Conformance :

No

REACH SVHC :

No SVHC

Connector Type :

Header

PCB Contact Pattern :

RECTANGULAR

Body Depth :

0.1 inch

Filter Feature :

No

Contact Finish - Post :

Tin

Fastening Type :

Push-Pull

Additional Feature :

E.L.P.

Number of Positions Loaded :

All

Gender :

Male

Packaging :

Bulk

Insulation Material :

Liquid Crystal Polymer (LCP)

Contact Finish - Mating :

Gold

Option :

GENERAL PURPOSE

MIL Conformance :

No

Contact Finish Thickness - Mating :

3.00μin 0.076μm

Contact Shape :

Square

Mating Contact Pitch :

0.1 inch

Mixed Contacts :

No

Insulation Color :

Natural

Row Spacing - Mating :

0.100 (2.54mm)

Series :

HTSW

Style :

Board to Board or Cable

Termination :

Solder

Contact Length - Mating :

0.820 20.83mm

Moisture Sensitivity Level (MSL) :

Not Applicable

Radiation Hardening :

No

Mount :

Through Hole

Body Breadth :

0.298 inch

Overall Contact Length :

1.030 26.16mm

Insulation Height :

0.100 2.54mm

Operating Temperature :

-55°C~125°C

Pbfree Code :

yes

Contact Type :

Male Pin

Factory Lead Time :

3 Weeks

Number of Positions :

90

Number of Rows :

3

Contact Material :

Phosphor Bronze

Current Rating (Amps) :

Varies by WireGAuge

Contact Length - Post :

0.110 2.79mm

Published :

2005

Reliability :

COMMERCIAL

Material Flammability Rating :

UL94 V-0

Pitch - Mating :

0.100 2.54mm

IEC Conformance :

No

Number Of PCB Rows :

3

RoHS Status :

ROHS3 Compliant

Number of Conductors :

ONE

Lead Pitch :

2.54mm

JESD-609 Code :

e3

Shrouding :

Unshrouded

Mounting Type :

Through Hole