HTSW-123-08-S-T

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Style :

Board to Board or Cable

Fastening Type :

Push-Pull

Contact Finish Thickness - Mating :

30.0μin 0.76μm

Number of Rows :

3

Number Of PCB Rows :

3

Pbfree Code :

yes

Insulation Material :

Liquid Crystal Polymer (LCP)

PCB Contact Row Spacing :

2.54 mm

Reliability :

COMMERCIAL

Insulation Height :

0.100 2.54mm

MIL Conformance :

No

Packaging :

Bulk

Termination :

Solder

Contact Finish - Post :

Tin

DIN Conformance :

No

Mounting Type :

Through Hole

Connector Type :

Header

Factory Lead Time :

3 Weeks

Gender :

Male

Insulation Color :

Natural

IEC Conformance :

No

Operating Temperature :

-55°C~125°C

Mixed Contacts :

No

Overall Contact Length :

0.530 13.46mm

Material Flammability Rating :

UL94 V-0

Mating Contact Pitch :

0.1 inch

Option :

GENERAL PURPOSE

Row Spacing - Mating :

0.100 (2.54mm)

RoHS Status :

ROHS3 Compliant

Body Breadth :

0.298 inch

Contact Finish - Mating :

Gold

Shrouding :

Unshrouded

PCB Contact Pattern :

RECTANGULAR

Terminal Pitch :

2.54mm

Moisture Sensitivity Level (MSL) :

Not Applicable

Number of Positions Loaded :

All

Number of Positions :

69

Filter Feature :

No

Pitch - Mating :

0.100 2.54mm

Contact Length - Post :

0.200 5.08mm

JESD-609 Code :

e3

Current Rating (Amps) :

Varies by WireGAuge

Contact Shape :

Square

Number of Conductors :

ONE

Contact Material :

Phosphor Bronze

Body Depth :

0.1 inch

Contact Length - Mating :

0.230 5.84mm

Contact Type :

Male Pin

Series :

HTSW

Mount :

Through Hole