HTSW-122-14-SM-D
- Mfr.Part #
- HTSW-122-14-SM-D
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 44POS 2.54MM
- Stock
- 26,192
- In Stock :
- 26,192
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Contact Length - Mating :
- 0.320 8.13mm
- Gender :
- Male
- Number of Positions Loaded :
- All
- Packaging :
- Bulk
- Number of Rows :
- 2
- Contact Length - Post :
- 0.110 2.79mm
- Contact Finish - Post :
- Tin
- Connector Type :
- Header
- Termination :
- Solder
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Current Rating (Amps) :
- Varies by WireGAuge
- Pitch - Mating :
- 0.100 2.54mm
- Fastening Type :
- Push-Pull
- Contact Shape :
- Square
- Operating Temperature :
- -55°C~125°C
- Overall Contact Length :
- 0.530 13.46mm
- Contact Type :
- Male Pin
- Number of Positions :
- 44
- Series :
- HTSW
- Material Flammability Rating :
- UL94 V-0
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Mounting Type :
- Through Hole
- Contact Material :
- Phosphor Bronze
- Factory Lead Time :
- 3 Weeks
- RoHS Status :
- ROHS3 Compliant
- Style :
- Board to Board or Cable
- Insulation Color :
- Natural
- Mount :
- Through Hole
- Insulation Height :
- 0.100 2.54mm
- Contact Finish - Mating :
- Gold
- Shrouding :
- Unshrouded
- Datasheets
- HTSW-122-14-SM-D
HTSW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 44-Position Board to Board or Cable 0.100 2.54mm Height
HTSW-122-14-SM-D Overview
The packaging contains Header.There is a Through Hole mounting type for the device.This product is packaged in a case marked Bulk.Product number HTSW belongs to the HTSW Series.There is a Through Hole mount on the part.This device operates at a temperature of -55°C~125°C.
HTSW-122-14-SM-D Features
HTSW series
HTSW-122-14-SM-D Applications
There are a lot of Samtec Inc.
HTSW-122-14-SM-D Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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