HTSW-113-23-G-D
- Mfr.Part #
- HTSW-113-23-G-D
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 26POS 2.54MM
- Stock
- 41,240
- In Stock :
- 41,240
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Contact Length - Mating :
- 0.230 5.84mm
- Number of Conductors :
- ONE
- Pitch - Mating :
- 0.100 2.54mm
- Additional Feature :
- E.L.P.
- Series :
- HTSW
- Packaging :
- Bulk
- Contact Shape :
- Square
- Connector Type :
- Header
- Operating Temperature :
- -55°C~125°C
- Number of Positions Loaded :
- All
- Body Depth :
- 0.1 inch
- IEC Conformance :
- No
- Shrouding :
- Unshrouded
- Contact Finish - Mating :
- Gold
- Insulation Color :
- Natural
- MIL Conformance :
- No
- Contact Material :
- Phosphor Bronze
- Mating Information :
- MULTIPLE MATING PARTS AVAILABLE
- Pbfree Code :
- yes
- Number of Positions :
- 26
- REACH SVHC :
- No SVHC
- Number Of PCB Rows :
- 2
- Body Length or Diameter :
- 1.3 inch
- Insulation Height :
- 0.100 2.54mm
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Factory Lead Time :
- 4 Weeks
- Current Rating (Amps) :
- Varies by WireGAuge
- Contact Length - Post :
- 0.115 2.92mm
- Material Flammability Rating :
- UL94 V-0
- Overall Contact Length :
- 0.445 11.30mm
- Option :
- GENERAL PURPOSE
- Gender :
- Male
- Mating Contact Pitch :
- 0.1 inch
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Contact Type :
- Male Pin
- Mount :
- Through Hole
- Fastening Type :
- Push-Pull
- Termination :
- Solder
- Row Spacing - Mating :
- 0.100 (2.54mm)
- JESD-609 Code :
- e4
- Number of Rows :
- 2
- Mixed Contacts :
- No
- PCB Contact Pattern :
- RECTANGULAR
- Mounting Type :
- Through Hole
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Filter Feature :
- No
- Reliability :
- COMMERCIAL
- Published :
- 2005
- Body Breadth :
- 0.198 inch
- Lead Pitch :
- 2.54mm
- Style :
- Board to Board or Cable
- RoHS Status :
- ROHS3 Compliant
- DIN Conformance :
- No
- Datasheets
- HTSW-113-23-G-D
HTSW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.100 2.54mm Height
HTSW-113-23-G-D Overview
Packaging is Header.Through Hole is the mounting type.Packaging for the product is carried out via a Bulk case.As a product of the HTSW Series, it can be found in this category.There are also other features such as E.L.P., to name only a few.In this case, Through Hole mounts the part.The device is operating at -55°C~125°C Operating Temperature.
HTSW-113-23-G-D Features
HTSW series
HTSW-113-23-G-D Applications
There are a lot of Samtec Inc.
HTSW-113-23-G-D Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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