HTSW-111-09-L-Q
- Mfr.Part #
- HTSW-111-09-L-Q
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 33POS 2.54MM
- Stock
- 46,589
- In Stock :
- 46,589
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Body Length or Diameter :
- 1.1 inch
- Body Breadth :
- 0.298 inch
- ECCN Code :
- EAR99
- Contact Finish - Mating :
- Gold
- Number of Conductors :
- ONE
- Style :
- Board to Board or Cable
- Contact Type :
- Male Pin
- Termination :
- Solder
- Material Flammability Rating :
- UL94 V-0
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Contact Length - Post :
- 0.400 10.16mm
- Factory Lead Time :
- 3 Weeks
- REACH SVHC :
- No SVHC
- Number of Rows :
- 3
- Number of Positions Loaded :
- 22
- Mounting Type :
- Through Hole
- PCB Contact Row Spacing :
- 5.08 mm
- Option :
- GENERAL PURPOSE
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Contact Shape :
- Square
- Reliability :
- COMMERCIAL
- Row Spacing - Mating :
- 0.100 (2.54mm)
- PCB Contact Pattern :
- RECTANGULAR
- Insulation Height :
- 0.100 2.54mm
- Lead Pitch :
- 2.54mm
- Mating Contact Pitch :
- 0.1 inch
- Connector Type :
- Header
- Overall Contact Length :
- 0.730 18.54mm
- Number Of PCB Rows :
- 2
- Mount :
- Through Hole
- Filter Feature :
- No
- Operating Temperature :
- -55°C~125°C
- DIN Conformance :
- No
- Contact Finish - Post :
- Tin
- RoHS Status :
- ROHS3 Compliant
- UL Flammability Code :
- 94V-0
- MIL Conformance :
- No
- Packaging :
- Bulk
- Series :
- HTSW
- Insulation Color :
- Natural
- Published :
- 2005
- Pitch - Mating :
- 0.100 2.54mm
- Fastening Type :
- Push-Pull
- Current Rating (Amps) :
- Varies by WireGAuge
- Gender :
- Male
- Mixed Contacts :
- No
- IEC Conformance :
- No
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Body Depth :
- 0.1 inch
- Contact Length - Mating :
- 0.230 5.84mm
- Shrouding :
- Unshrouded
- Contact Material :
- Phosphor Bronze
- Number of Positions :
- 33
- Datasheets
- HTSW-111-09-L-Q
HTSW Series 3-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 33-Position Board to Board or Cable 0.100 2.54mm Height
HTSW-111-09-L-Q Overview
Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the HTSW Series.There is a mounting hole at Through Hole.Devices operate at -55°C~125°C operating temperatures.
HTSW-111-09-L-Q Features
HTSW series
HTSW-111-09-L-Q Applications
There are a lot of Samtec Inc.
HTSW-111-09-L-Q Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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