EMM10DRAS

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Mfr.Part #
EMM10DRAS
Manufacturer
Sullins Connector Solutions
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 20POS 0.156
Stock
10,702
In Stock :
10,702

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Manufacturer :
Sullins Connector Solutions
Product Category :
Edgeboard Connectors
Pbfree Code :
yes
ECCN Code :
EAR99
Card Thickness :
0.062 1.57mm
JESD-609 Code :
e4
Body Depth :
0.637 inch
HTS Code :
8536.69.40.40
Operating Temperature :
-65°C~125°C
Mounting Type :
Through Hole, Right Angle
RoHS Status :
ROHS3 Compliant
Number of Rows :
2
Reference Standard :
UL, CSA
Pitch :
0.156 3.96mm
Flange Feature :
Side Mount Opening, Unthreaded, 0.125 (3.18mm) Dia
PCB Contact Pattern :
RECTANGULAR
Card Type :
Non Specified - Dual Edge
Number Of PCB Rows :
2
Additional Feature :
NONE
Body/Shell Style :
Receptacle
Total Number of Contacts :
20
Reliability :
COMMERCIAL
Number of Conductors :
ONE
Number of Positions :
20
Contact Finish :
Gold
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
Not Applicable
Plating Thickness :
30μin
Rated Current (Signal) :
3A
Lead Free :
Lead Free
Material - Insulation :
Polybutylene Terephthalate (PBT)
Insertion Force-Max :
4.448 N
Gender :
FEMALE
Termination :
Solder
Contact Material :
Phosphor Bronze
Published :
2015
Connector Type :
Full Bellows
Dielectric Withstanding Voltage :
1800VDC V
Color :
Blue
Mount :
Through Hole
Factory Lead Time :
3 Weeks
Insulation Resistance :
5000000000Ohm
Read Out :
Dual
Contact Finish Thickness :
30.0μin 0.76μm
Contact Type :
Full Bellows
Number of Positions/Bay/Row :
10
Datasheets
EMM10DRAS
Introducing Edgeboard Connectors Sullins Connector Solutions EMM10DRAS from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-65°C~125°C, Mounting Type:Through Hole, Right Angle, EMM10DRAS pinout, EMM10DRAS datasheet PDF, EMM10DRAS amp .Beyond Edgeboard Connectors Sullins Connector Solutions EMM10DRAS ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.



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