EDB4064B4PB-1DIT-F-R

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Mfr.Part #
EDB4064B4PB-1DIT-F-R
Manufacturer
Micron Technology
Package / Case
216-WFBGA
Datasheet
Download
Description
IC DRAM 4GBIT PARALLEL 216WFBGA
Stock
20,087
In Stock :
20,087

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Manufacturer :
Micron Technology
Product Category :
Memory
Operating Temperature :
-40°C~85°C TC
Package / Case :
216-WFBGA
Voltage - Supply :
1.14V~1.95V
Factory Lead Time :
9 Weeks
Memory Size :
4Gb 64M x 64
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Memory Interface :
Parallel
Memory Type :
Volatile
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Memory Format :
DRAM
Clock Frequency :
533MHz
Introducing Memory Micron Technology EDB4064B4PB-1DIT-F-R from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TC, Package / Case:216-WFBGA, Mounting Type:Surface Mount, EDB4064B4PB-1DIT-F-R pinout, EDB4064B4PB-1DIT-F-R datasheet PDF, EDB4064B4PB-1DIT-F-R amp .Beyond Memory Micron Technology EDB4064B4PB-1DIT-F-R ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology EDB4064B4PB-1DIT-F-R


Memory Micron Technology EDB4064B4PB-1DIT-F-R Overview

Introducing the Memory Micron Technology EDB4064B4PB-1DIT-F-R, a high-capacity, performance-driven IC DRAM component designed to meet the rigorous demands of modern technology applications. With a 4Gbit density, this memory module is fabricated using Micron Technology's advanced design techniques, ensuring reliable and efficient performance. The 216-ball WFBGA (Fine-Pitch Ball Grid Array) package offers a compact footprint while providing robust data storage capabilities. Ideal for developers and manufacturers focusing on enhancing computing and processing power in various devices, this memory module is a cornerstone in advancing technological innovation.

EDB4064B4PB-1DIT-F-R Features

The EDB4064B4PB-1DIT-F-R DRAM from Micron Technology is equipped with a 4Gbit parallel interface, providing substantial throughput and speed. It supports extended operating temperatures, making it suitable for use in environments requiring high reliability. The compact 216WFBGA packaging ensures a minimal physical footprint, allowing for greater design flexibility in space-constrained applications.

EDB4064B4PB-1DIT-F-R Applications

  • Smartphones and Tablets: Utilizes high-speed data access to enhance multitasking and application performance, providing a smoother user experience in compact devices.
  • Personal Computers and Laptops: Boosts system responsiveness and allows for efficient handling of large-scale software applications, improving overall system performance.
  • Embedded Systems: Offers reliable and durable performance under varied environmental conditions, ideal for use in advanced robotics and automotive systems.
  • Networking Equipment: Enhances data buffer capabilities, crucial for managing high-speed internet and network traffic efficiently in routers and switches.
  • Server and Data Centers: Provides scalable memory solutions that support the demands of data-intensive applications, crucial for server reliability and data integrity.
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Shipping Cost

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